As SMT and semiconductor manufacturing advance toward ultra-miniaturized, high-density component mounting, SMT pick-and-place suction nozzles easily accumulate hardened solder paste, flux and micro-debris during mass production. Clogged nozzles trigger frequent component dropping, misplacement and production downtime, becoming a critical bottleneck for electronic assembly factories.
HSTECH HS-824 automatic nozzle cleaning machine adopts patented high-pressure pulse jet cleaning technology, solving all defects of traditional ultrasonic, manual needle poking and solvent washing. It only uses harmless industrial purified soft water (pH 5–7) to thoroughly clear internal dirt from tiny nozzle apertures without scratching nozzles, reflector plates or 2D codes. Fully automated operation, eco-friendly design and industry-leading cleaning efficiency make it a must-have maintenance device for modern SMT production lines.
Continuous high-pressure water fragmentation generates micro mist particles as small as 3–10μm, penetrating ultra-fine nozzle inner holes to strip hidden residue that ultrasonic cleaning cannot reach.
Water mist sprays at sonic velocity (360m/s) to form a continuous high-energy field covering the whole nozzle. Powerful pulse impact shatters cured solder and flux thoroughly from both nozzle surface and internal channels.
No IPA, chemical solvent or corrosive detergent required. Neutral soft water prevents peeling black nozzle coatings, fading reflector films and damaged two-dimensional codes. Zero toxic waste for green manufacturing compliance.
Patented Precision Cleaning Technology
Perfectly cleans micro nozzles for 01005/0201 ultra-small chips; removes stubborn hardened paste completely without mechanical abrasion.
Ultra-High Automated Efficiency
Clean 24 nozzles per single 3-minute cycle; up to 460 pcs/hour cleaning capacity, 4–5x faster than manual cleaning, double the throughput of ultrasonic cleaners.
Full Protection for SMT Consumables
No chemical erosion, no needle scratch damage. Safely guard nozzle black coating, reflective plates and QR marking, extend nozzle service life significantly and cut spare part procurement cost.
Eco-Friendly & Low Operation Cost
Premium Global Brand Core Components for Stable Durability
Fully Automatic Intelligent Operation
One-touch touchscreen operation, transparent observation window to monitor full cleaning process; customizable nozzle trays compatible with all mainstream pick-and-place machine brands (Yamaha, JUKI, Samsung, Panasonic, FUJI, Siemens etc.)
Optional Matching Inspection Microscope
320x combined optical+physical zoom microscope with adjustable backlight. Backlight illumination clearly checks internal nozzle blockage after cleaning; customized fixture tray positioning reduces repeated manual alignment for rapid quality verification.
Ideal for all SMT & semiconductor assembly factories producing:
Compatible with all suction nozzles from major mounter brands: Yamaha, JUKI, Samsung Hanwha, Panasonic, FUJI, Hitachi, Siemens. Custom nozzle trays available upon request.
As SMT and semiconductor manufacturing advance toward ultra-miniaturized, high-density component mounting, SMT pick-and-place suction nozzles easily accumulate hardened solder paste, flux and micro-debris during mass production. Clogged nozzles trigger frequent component dropping, misplacement and production downtime, becoming a critical bottleneck for electronic assembly factories.
HSTECH HS-824 automatic nozzle cleaning machine adopts patented high-pressure pulse jet cleaning technology, solving all defects of traditional ultrasonic, manual needle poking and solvent washing. It only uses harmless industrial purified soft water (pH 5–7) to thoroughly clear internal dirt from tiny nozzle apertures without scratching nozzles, reflector plates or 2D codes. Fully automated operation, eco-friendly design and industry-leading cleaning efficiency make it a must-have maintenance device for modern SMT production lines.
Continuous high-pressure water fragmentation generates micro mist particles as small as 3–10μm, penetrating ultra-fine nozzle inner holes to strip hidden residue that ultrasonic cleaning cannot reach.
Water mist sprays at sonic velocity (360m/s) to form a continuous high-energy field covering the whole nozzle. Powerful pulse impact shatters cured solder and flux thoroughly from both nozzle surface and internal channels.
No IPA, chemical solvent or corrosive detergent required. Neutral soft water prevents peeling black nozzle coatings, fading reflector films and damaged two-dimensional codes. Zero toxic waste for green manufacturing compliance.
Patented Precision Cleaning Technology
Perfectly cleans micro nozzles for 01005/0201 ultra-small chips; removes stubborn hardened paste completely without mechanical abrasion.
Ultra-High Automated Efficiency
Clean 24 nozzles per single 3-minute cycle; up to 460 pcs/hour cleaning capacity, 4–5x faster than manual cleaning, double the throughput of ultrasonic cleaners.
Full Protection for SMT Consumables
No chemical erosion, no needle scratch damage. Safely guard nozzle black coating, reflective plates and QR marking, extend nozzle service life significantly and cut spare part procurement cost.
Eco-Friendly & Low Operation Cost
Premium Global Brand Core Components for Stable Durability
Fully Automatic Intelligent Operation
One-touch touchscreen operation, transparent observation window to monitor full cleaning process; customizable nozzle trays compatible with all mainstream pick-and-place machine brands (Yamaha, JUKI, Samsung, Panasonic, FUJI, Siemens etc.)
Optional Matching Inspection Microscope
320x combined optical+physical zoom microscope with adjustable backlight. Backlight illumination clearly checks internal nozzle blockage after cleaning; customized fixture tray positioning reduces repeated manual alignment for rapid quality verification.
Ideal for all SMT & semiconductor assembly factories producing:
Compatible with all suction nozzles from major mounter brands: Yamaha, JUKI, Samsung Hanwha, Panasonic, FUJI, Hitachi, Siemens. Custom nozzle trays available upon request.