Catching the Invisible: Why THT AOI After Wave Solder Is Critical for Through-Hole Quality Control
As through-hole technology (THT) remains widely used in automotive, industrial, and power electronics, post-wave solder inspection has become a growing challenge for PCB assemblers.
Traditional manual visual inspection (MVI) is no longer reliable — especially after wave soldering, where solder bridges, insufficient fill, flux residue, and hidden shorts can easily escape detection.
To address this, a new generation of THT AOI (Automated Optical Inspection) systems is now being deployed directly after wave solder, providing real-time, high-speed inspection of through-hole components without slowing down production lines.
Inspection of defects such as excess solder, insufficient solder, solder bridging, no pin exposure, cold solder, solder void, solder balls, wrong parts, missing parts, etc. in post-wave soldering process.
| Category | Specification | Solder Joint Inspection Intelligent AOI |
|---|---|---|
| Model | HS-D1510 (Bottom View Solder Joint Inspection, Standard) | Solder Joint Inspection Intelligent AOI |
| HS-D1510L (Bottom View Solder Joint Inspection for Large Board) | ||
| Performance Parameters | ||
| Detection Method | Convolutional Neural Network, advanced deep learning models and other multiple algorithms | |
| New Program Creation | Approx. 5-20 minutes for new machine | |
| Inspection Speed | 0.22sec/FOV | |
| PCBA Size | Standard: 50mm*50mm~510mm*460mm; Large Board: 50mm*50mm~710mm*640mm | |
| PCBA Thickness | 0.5mm~6mm | |
| PCBA Component Height | Top: 120~165mm; Bottom: 50~90mm | |
| Camera Resolution | Standard 15MP | |
| Hardware Configuration | ||
| Light Source | RGBW four-color ring LED light source | |
| Camera | 12MP color area scan industrial camera, optional configuration as needed | |
| CPU | Intel i7, optional i9 | |
| GPU | NVIDIA 12G, optional 16G | |
| Memory/Storage | 64G DDR / 1T SSD + 8T mechanical hard drive | |
| Monitor | 23.8" FHD display | |
| Motion Mechanism | Marble platform, high-precision servo motor lead screw | |
| Track Adjustment | Electric | |
| Track Load | Chain ≤12kg, customizable heavy load 25KG; Solder point side: belt ≤3kg, or chain ≤15kg | |
| System Equipment | ||
| Operating System | Ubuntu 20.04 LTS 64bit | |
| Control System | Motion control card, PLC and upper computer control | |
| Working Voltage | AC 220V±10% | |
| Power Consumption | MAX 1kw | |
| External Dimensions / Electrical | ||
| Temperature/Humidity | Working temperature 0~45℃, 20%~80%RH without condensation | |
| Overall Weight | Standard machine: 525KG; Large board machine: 700KG | |
| External Dimensions | Standard: L*W*H = 1060mm*1340mm*1500mm (Note: excluding display bracket, three-color light) | |
| Large board: L*W*H = 1335mm*1522mm*1533mm (Note: excluding display bracket, three-color light) | ||
If your production line includes:
…then adding THT AOI after wave solder is no longer an option — it is a quality necessity.
Catching the Invisible: Why THT AOI After Wave Solder Is Critical for Through-Hole Quality Control
As through-hole technology (THT) remains widely used in automotive, industrial, and power electronics, post-wave solder inspection has become a growing challenge for PCB assemblers.
Traditional manual visual inspection (MVI) is no longer reliable — especially after wave soldering, where solder bridges, insufficient fill, flux residue, and hidden shorts can easily escape detection.
To address this, a new generation of THT AOI (Automated Optical Inspection) systems is now being deployed directly after wave solder, providing real-time, high-speed inspection of through-hole components without slowing down production lines.
Inspection of defects such as excess solder, insufficient solder, solder bridging, no pin exposure, cold solder, solder void, solder balls, wrong parts, missing parts, etc. in post-wave soldering process.
| Category | Specification | Solder Joint Inspection Intelligent AOI |
|---|---|---|
| Model | HS-D1510 (Bottom View Solder Joint Inspection, Standard) | Solder Joint Inspection Intelligent AOI |
| HS-D1510L (Bottom View Solder Joint Inspection for Large Board) | ||
| Performance Parameters | ||
| Detection Method | Convolutional Neural Network, advanced deep learning models and other multiple algorithms | |
| New Program Creation | Approx. 5-20 minutes for new machine | |
| Inspection Speed | 0.22sec/FOV | |
| PCBA Size | Standard: 50mm*50mm~510mm*460mm; Large Board: 50mm*50mm~710mm*640mm | |
| PCBA Thickness | 0.5mm~6mm | |
| PCBA Component Height | Top: 120~165mm; Bottom: 50~90mm | |
| Camera Resolution | Standard 15MP | |
| Hardware Configuration | ||
| Light Source | RGBW four-color ring LED light source | |
| Camera | 12MP color area scan industrial camera, optional configuration as needed | |
| CPU | Intel i7, optional i9 | |
| GPU | NVIDIA 12G, optional 16G | |
| Memory/Storage | 64G DDR / 1T SSD + 8T mechanical hard drive | |
| Monitor | 23.8" FHD display | |
| Motion Mechanism | Marble platform, high-precision servo motor lead screw | |
| Track Adjustment | Electric | |
| Track Load | Chain ≤12kg, customizable heavy load 25KG; Solder point side: belt ≤3kg, or chain ≤15kg | |
| System Equipment | ||
| Operating System | Ubuntu 20.04 LTS 64bit | |
| Control System | Motion control card, PLC and upper computer control | |
| Working Voltage | AC 220V±10% | |
| Power Consumption | MAX 1kw | |
| External Dimensions / Electrical | ||
| Temperature/Humidity | Working temperature 0~45℃, 20%~80%RH without condensation | |
| Overall Weight | Standard machine: 525KG; Large board machine: 700KG | |
| External Dimensions | Standard: L*W*H = 1060mm*1340mm*1500mm (Note: excluding display bracket, three-color light) | |
| Large board: L*W*H = 1335mm*1522mm*1533mm (Note: excluding display bracket, three-color light) | ||
If your production line includes:
…then adding THT AOI after wave solder is no longer an option — it is a quality necessity.