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Integrated Selective Wave Soldering Machine with Infrared Preheating 1KW and Touch Screen Control for Flexible Small Batch Production

Name: Integrated Selective Wave Soldering Machine with Infrared Preheating 1KW and Touch Screen Control for Flexible Small Batch Production
Brand: Shenzhen Hansome Technology Co., Ltd.
SKU: SW-320YT
Price: 3,450.00 USD
Availability: InStock

Brand Name:	HSTECH
Model Number:	SW-320YT
MOQ:	1PC
Price:	negotiation
Payment Terms:	T/T
Supply Ability:	30000PCS

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Pcb Dimension:

L(50*50)-(450*330)mm

Dimensions:

L600*W960*H1600mm

Step Length Optional:

30 / 60mm Or Manual Operation

Relay Brand:

Schneider

Air Supply:

4-6bar,max 15L/min

Total Power:

2600W

Voltage:

1P AC 110V/220V 50/60HZ

Control:

Touch Screen

Packaging Details:

Wooden

Supply Ability:

30000PCS

Highlight:

Infrared Preheating 1KW Selective Wave Soldering Machine

Touch Screen Control Offline Wave Soldering Machine

Flexible Small Batch Production Automatic Soldering Robot

Product Description

Integrated Selective Wave Soldering Machine

Small offline wave soldering machine with infrared preheating 1KW for precision PCB assembly

Key Features

Flexible production for multiple varieties and small batches
Quick setup for soldering without fixtures required
Low initial equipment investment cost
Reduced operating costs (savings on tin slag, flux, electricity and consumables)
100% tin penetration rate with over 98% soldering yield
Compact footprint (approximately 1m²)

Technical Specifications

Model SW-320YT

Applicable PCB Size	L×W: 50×50～320×250 mm
Applicable PCB Thickness	Substrate: 0.8～3 mm / Pin length: <3mm
Elements Height	Substrate top <100mm / Substrate bottom <50mm
Substrate Conditions	Process edge ≥3mm, Weight <5KG, Bending <0.5mm
Tin Furnace	Titanium alloy material, 15KG capacity, 1.8KW power
Preheating Power	Infrared preheating 1KW
Total Power	AC 220V 3.5KW
N₂ Requirements	99.999% purity, 0.5MPa pressure, 1.2m³/H consumption
Flux Spray Nozzle	0.5mm precision fluid spray nozzle (Japan import)
Flux Capacity	2 L
Air Source	0.5-0.7Mpa
Spray Nozzle Inside Diameter	φ 3mm～φ 20mm (customizable)
Wave Crest Height	Automatic alignment/height measurement
System Control	PC+PLC (Windows+Siemens)
Program Software	Support online or offline image programming
Video Monitoring	Real-time video monitoring for soldering effects
Power Supply	Single phase 220V±10%, Starting power: 3.5KW
Weight	120KG (including 15KG soldering tin)
External Dimensions	750×950×1350 mm (with monitor) 1000×980×1580 mm (with top cover)

Model SW-450YT

Applicable PCB Size	L×W: 50×50～450×400 mm
Applicable PCB Thickness	Substrate: 0.8～3 mm / Pin length: <3mm
Elements Height	Substrate top <100mm / Substrate bottom <50mm
Substrate Conditions	Process edge ≥3mm, Weight <5KG, Bending <0.5mm
Tin Furnace	Titanium alloy material, 15KG capacity, 1.8KW power
Preheating Power	Infrared preheating 1KW
Total Power	AC 220V 3.5KW
N₂ Requirements	99.999% purity, 0.5MPa pressure, 1.2m³/H consumption
Flux Spray Nozzle	0.5mm precision fluid spray nozzle (Japan import)
Flux Capacity	2 L
Air Source	0.5-0.7Mpa
Spray Nozzle Inside Diameter	φ 3mm～φ 20mm (customizable)
Wave Crest Height	Automatic alignment/automatic height measurement
System Control	PC+PLC (Windows+Siemens)
Program Software	Support programming for drawing lines in images
Video Monitoring	Real-time video monitoring for soldering effects
Power Supply	Single phase 220V±10%, Starting power: 3.5KW
Weight	150KG (including 15KG soldering tin)
External Dimensions	880×1280×1350 mm (with monitor) 1270×1280×1580 mm (excluding tri-colored lights)

PCB Board Preheating Systems

Top Side Preheating (Optional)

1KW infrared heating tube preheats the PCB board top before soldering, meeting high temperature requirements for special elements. Reduces thermal shock, activates flux activity, improves pin tin penetration, and enhances overall soldering quality.

Bottom Side Preheating

Utilizes fast infrared heat conduction to preheat PCB boards before soldering and maintains heating during the process. Features synchronized "preheating + soldering" design principle that improves efficiency, increases tin penetration rate, reduces thermal shock for heat-sensitive elements, and ensures high cleanliness of PCB after soldering.

Consumables - Spray Nozzles

Nozzles can be selected according to solder joint size requirements. Provides precise control over solder penetration rate and soldering time for each individual solder point.

Machine Components

Tags:

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

products details

Integrated Selective Wave Soldering Machine with Infrared Preheating 1KW and Touch Screen Control for Flexible Small Batch Production

Integrated Selective Wave Soldering Machine with Infrared Preheating 1KW and Touch Screen Control for Flexible Small Batch Production

Infrared Preheating 1KW Selective Wave Soldering Machine

Touch Screen Control Offline Wave Soldering Machine

Flexible Small Batch Production Automatic Soldering Robot