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PCB Depaneling Equipment
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Self-locked Precisely Cut PCB Depaneling Machine with 300mm/s Cutting Speed for PCB Separation

Self-locked Precisely Cut PCB Depaneling Machine with 300mm/s Cutting Speed for PCB Separation

Brand Name: HSTECH
Model Number: HS-203
MOQ: 1 set
Price: negotiation
Payment Terms: T/T
Supply Ability: 500 PC/month
Detail Information
Place of Origin:
China
Certification:
CE
Application:
PCB Assembly
Packing:
Wrap, Wooden Box
Cutting Speed:
300mm/s
Weight:
60KG
Dimensions:
Customizable
Power Supply:
Single-phase AC220V 50-60HZ
Packaging Details:
Wooden
Supply Ability:
500 PC/month
Highlight:

self-locked PCB board separator

,

precisely cut knife type separator

,

PC board PCB cutting tool

Product Description
Self-locked And Precisely Cut Knife Type Board Separator With PC Board for PCB Cutting
In PCB manufacturing, multiple identical small circuit boards are often assembled into a single large board for production efficiency. After assembly completion, these boards require clean, non-destructive separation through a process called depaneling. This specialized machine performs this critical function with precision and reliability.
Technical Specifications
Power Supply Single-phase AC220V 50-60HZ
Weight 60KG
Machine Dimensions 770mm (L) × 370mm (W) × 420mm (H)
Cutting Speed 300mm/s
Maximum Knife Wheel Stroke 350mm
Knife Wheel Fine Adjustment 0-3mm
Lower Knife Adjustment 0-2mm
Maximum PC Board Cutting Width 150mm
Maximum PC Board Cutting Length 350mm
PC Board Thickness Range 0.6-3.2mm
V-Groove Thickness Range 0.25-2.0mm
Key Features & Benefits
  • Infrared safety protection system stops machine operation when hands or foreign objects enter the cutting area
  • Stepper motor drive enables self-locking and precise cutting positioning when powered
  • Eliminates travel point variations common with DC and AC motors due to inertia
  • Prevents damage to circuits and electronic components during separation
  • Significantly improves work efficiency and production quality
  • Upper circular knife and lower flat knife design reduces stress during cutting
  • Prevents solder joint cracking and component breakage
  • Produces smooth, clean cuts without board separation issues
  • High-speed steel blades offer durability and can be re-sharpened approximately twice
Depaneling Technology Comparison
Scoring Depaneler
Principle: High-speed rotating milling cutter cuts along pre-designed V-grooves
Advantages: Fast operation, relatively low cost, suitable for simple shapes and straight lines
Disadvantages: Generates stress dust and places stress on board edges, unsuitable for fragile or high-density boards
Routing Depaneler
Principle: CNC-style high-speed spindle drives milling cutter along programmed paths
Advantages: Minimal stress, capable of cutting any shape (curved or irregular), high precision with clean edges
Disadvantages: Slower than scoring, higher equipment and maintenance costs
Applications: Mobile phones, automotive electronics, aerospace, and other high-reliability applications
Laser Depaneler
Principle: High-energy laser beam melts material for contactless cutting
Advantages: Completely stress-free, extremely high precision, narrow kerf, dust-free, suitable for delicate FPCs
Disadvantages: High equipment cost, relatively slow cutting speed, complex parameter adjustments for different materials
Product Images
Self-locked Precisely Cut PCB Depaneling Machine with 300mm/s Cutting Speed for PCB Separation 0 Self-locked Precisely Cut PCB Depaneling Machine with 300mm/s Cutting Speed for PCB Separation 1 Self-locked Precisely Cut PCB Depaneling Machine with 300mm/s Cutting Speed for PCB Separation 2 Self-locked Precisely Cut PCB Depaneling Machine with 300mm/s Cutting Speed for PCB Separation 3