5.5KW High Precision Selective Wave Soldering Machine With N2 Protection For PCB Soldering System

Applicable PCB Board Size

L*W: 50×50 ~ 600×500 mm

Applicable PCB Board Thickness

Substrate Thickness: 0.8 ~ 3 mm / Lead Length: Within 3mm

Component Height

Below 150mm above the substrate / Below 75mm below the substrate

Substrate Shape & Conditions

1. Substrate Edge Margin: ≥3mm of substrate process edge2. Weight of components with substrate: ≤5KG3. Substrate Warpage: ≤0.5 mm

Solder Pot

Solder Pot Material/Capacity: Full titanium alloy material / 12KGSolder Tank Capacity: Power: 4*500W 2KW

Bottom Full-board Preheating

Infrared preheating 2.5 KW

Synchronous Preheating Power During Soldering

Infrared preheating 800 W

Total Power

AC 220V 5.5KW

N₂ Requirements

Nitrogen Purity: 99.999%Pressure/Consumption: 0.5MPa / 20ℓ/min~30ℓ/min / 1.2-1.8 cubic H

Flux Nozzle

0.5mm Japan imported original precision atomizing nozzle / 130um line spray (optional)

Flux Capacity

2 L

Air Source

0.5-0.7Mpa

Nozzle Inner Diameter

φ 3mm ~ φ 20mm, customizable size

Wave Height

Automatic calibration/height measurement

System Control

PC+PLC (Windows + Huichuan)

Programming Software

Support programming by picture drawing (convenient and fast)

Video Monitoring

Real-time video monitoring for easy viewing of soldering effects

Power/Power Rating

Single-phase 220V±10% Starting power: 5KW

Weight

400KG (including 12KG solder)

Overall Dimensions

LWH 1200×1530×1600 mm