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High‑precision Spraying Off‑line Selective Wave Soldering Machine For Small‑batch DIP Through‑hole Production

High‑precision Spraying Off‑line Selective Wave Soldering Machine For Small‑batch DIP Through‑hole Production

Brand Name: HSTECH
Model Number: SW‑320YT/450YT
MOQ: 1 PC
Price: negotiation
Payment Terms: T/T
Supply Ability: 50 PC/Month
Detail Information
Place of Origin:
China
Certification:
CE,ISO
Product Name:
Selective Wave Soldering Machine
PCB Thickness:
0.8‑3 mm
Air Supply Pressure:
0.5‑0.7 MPa
Flux Tank Capacity:
2 L
Preheating Power:
Infrared 1 KW
Warranty:
1 Year
Packaging Details:
Wooden
Supply Ability:
50 PC/Month
Highlight:

high-precision wave soldering machine

,

off-line selective soldering robot

,

small-batch DIP through-hole production

Product Description
High-precision Spraying Off-line Selective Wave Soldering Machine For Small-batch DIP Through-hole Production
Product Overview
HSTECH off-line selective wave soldering machine is engineered for mix-variety, small-batch DIP plug-in soldering. This integrated system combines flux spraying, infrared preheating, and selective wave soldering in a single compact unit, enabling fast production startup without custom fixtures.
Occupying only approximately 1㎡ of floor space, the equipment conserves valuable workshop area. Compared to conventional wave soldering systems, it significantly reduces consumption of solder dross, flux, and electricity. The machine delivers nearly 100% through-hole tin penetration rate with soldering yield exceeding 98%, providing a cost-effective PCBA through-hole soldering solution for automotive electronics, industrial control, and medical electronics industries.
Controlled by an Industrial PC, the machine supports offline visual programming. Operators can complete programming on office computers and import files directly to the machine for production. Real-time video monitoring and automatic wave-crest height detection ensure visible soldering processes and simplified commissioning. The fully-titanium solder pot offers exceptional molten-solder corrosion resistance with a quick-detach design for convenient maintenance.
Key Advantages
  • Flexible Production, No Fixture Required: Supports quick change-over for multiple products. PCBs with safe clearance can be soldered directly without custom tooling costs for new product sampling.
  • Ultra-low Operating Cost: 15KG solder pot capacity generates only 0.2KG solder dross per 8-hour shift. Sealed flux spraying system eliminates flux evaporation waste. Total power consumption of 3.5KW significantly reduces energy usage compared to traditional wave soldering.
  • Superior Soldering Quality: Dual-side infrared preheating (top & bottom) with synchronized preheating and soldering minimizes thermal shock for heat-sensitive components. Automatic alignment and height measurement ensure stable solder flow with 100% through-hole penetration rate and over 98% yield. N₂ protection (99.999% purity) delivers bright solder joints with minimal oxidation.
  • High-precision Spraying & Soldering System: Original Japan Lumina 0.5 mm precision flux spray nozzle. Interchangeable soldering nozzles from φ3 mm-φ20 mm with custom sizes available, matching dedicated nozzles for each joint to precisely control flux dosage and soldering time.
  • Intelligent Software & Visual Monitoring: Offline image-based programming allows importing PCB graphics to draw soldering paths. Real-time video displays wave-crest conditions and soldering performance for comprehensive process observation.
  • Compact Footprint & Easy Maintenance: Approximately 1㎡ floor area with quick-release solder pot and centralized wiring. Liquid-gas modules are physically isolated from electrical cabinet to enhance safety and simplify service work.
Technical Specifications
Specification SW-320YT SW-450YT
Applicable PCB Size 50×50 ~ 320×250 mm 50×50 ~ 450×400 mm
PCB Thickness 0.8-3 mm; Pin length <3 mm 0.8-3 mm; Pin length <3 mm
Component Height Top side <100 mm / Bottom side <50 mm Top side <100 mm / Bottom side <50 mm
Max. PCB Weight (with components) ≤5 KG ≤5 KG
Solder Pot Full titanium alloy, 15KG capacity, 1.8 KW power Full titanium alloy, 15KG capacity, 1.8 KW power
Preheating Power Infrared 1 KW Infrared 1 KW
Total Power AC 220V, 3.5 KW AC 220V, 3.5 KW
Nitrogen Requirement Purity 99.999%; Pressure 0.5 MPa; Consumption 20-30 L/min Purity 99.999%; Pressure 0.5 MPa; Consumption 20-30 L/min
Flux Tank Capacity 2 L 2 L
Air Supply Pressure 0.5-0.7 MPa 0.5-0.7 MPa
Soldering Nozzle Inner Dia. φ3-φ20 mm, custom-supported φ3-φ20 mm, custom-supported
Control System Industrial PC + (Windows OS) Industrial PC + (Windows OS)
Programming Mode Online / Off-line image visual programming Online / Off-line image visual programming
Machine Weight 120 KG (including 15KG solder) 150 KG (including 15KG solder)
External Dimension (with monitor) 750 × 950 × 1350 mm 880 × 1280 × 1350 mm
Application Industries
Industrial control PCBA, automotive electronics, security equipment, medical electronics, power supply modules, communication modules, small-batch DIP through-hole assembly and new product sampling.