logo

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Solder Paste Machine
Created with Pixso.

GKG G9 High-end Solder Paste Printing Machine with CCD Digital System

GKG G9 High-end Solder Paste Printing Machine with CCD Digital System

Brand Name: GKG
Model Number: G9+
MOQ: 1 set
Price: Negotiable
Payment Terms: T/T,Western Union,MoneyGram
Supply Ability: 50 sets per month
Detail Information
Place of Origin:
China
Certification:
CE,TUV,ROHS
Product Name:
High-end Solder Paste Printing Machine
Other Name:
Automatic Screen Printing Machine
PCB Size:
50x50~450x340mm
Transport Height:
900±40mm
Air Pressure:
4-6kgf/cm³
PCB Thickness:
0.4-6mm
Max Board Weight:
5kg
Machine Weight:
1000kg
Packaging Details:
Wooden package
Supply Ability:
50 sets per month
Product Description

GKG G9 High-end Solder Paste Printing Machine with CCD Digital System


Introduction


The G9+ Automatic solder paste printing machine is a high-end machine for SMT high-end application, which can satisfy the printing process requirements of 03015,0.25pitch, high precision and high speed.


Specification

Model G9+
Max PCB Size 450x340mm
Min PCB size 50x50mm
PCB thickness 0.4-6mm
Max board weight 5kg
Transport height 900±40mm
Board edge gap 2.5mm
Board height 15mm
Transport direction L-R,R-L
Transport speed max 1500mm/s, program control
Transport method One stage
WIdth adjustment automatic
I/O interface SMEMA
PCB positioning (support method) Magnetic pin/support block/manual up-down table
PCB clamping system
Patented over the top clamping
Side clamping
Adsorption function
Print snap-off
0-20mm
Print mode
one/twice
Print Speed
10-200mm/sec
Print Mode
One /Twice
Squeegee Type
Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
Print pressure 0.5-10kg
Template fram size 470*370mm~737*737mm(20-40thickness)
Cleaning System
Droops of rain type cleaning system
Reinforced vacuum absorption
Dry, wet vacuum three modes
Back and forth cleaning
CCD FOV
10x8mm
Fiducial mark types Standard Fiducial mark shape
Pad
Hole
Camera system Look up/down optics structure
CCD digital camera
Geometry pattern match


Machine Performance

Model G9+
Repeat position accuracy ±12.5um@6,CPK≥2.0
Print accuracy ±18um@6,CPK≥2.0
Print cycle time <7.5 sec
Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision


Whole Machine Specification

Power supply
AC:220±10%,50/60HZ, 3.0KW
Air pressure
4~6 kgf/cm²
Air consumption
around 5L/min
Operating temperature
-20℃~+45℃
Operating humidity
30%~60%
Machine Dimensions(without tower light)
1172(L) x 1385(W) x 1530 (H)mm
Machine Weight
Approx: around 1000Kg


Features


1, CCD digital system, total new optical path system, uniform circular light and high brightness of coaxial light source. With both light source system, brightness can adjust to an infinite loop, allowing different mart point can be easily recognize (including uneven mark point) such as tin plating, copper plating, silver plating, hot air soldering, FPC and various types of different PCB color.


2, High precision PCB thickness adjustment, extremely reliable structure with stable XY movement. Manual adjustment makes it a breeze to accommodate different PCB thickness.

3,Guide rail positioning system, new Pattern guide rail ban detachable, programmable flexible side clamp, specific to FPC, PCB warpage, perform a unique clamping plate device. Through software programming can automatically stretch out and draw back unaffected PCB pickness.

4, New innovative squeegee structure design, adopt a comprehensive squeegee system which enhances stability and long lifespan.

5, High speed stencil cleaning, downward dispensing cleaning structure successfully prevents clogged opening(which is always the root cause for ineffective cleaning) from taking place. The length of solvent dispensedcan also be easilyamended with software control.

6, New multi-function interface, simplicity , clearly understand, friendly user. Actual temperature and humidity monitor function.

The core components of solder paste printers


(1) Printing platform (PCB Holder)
Used to fix the PCB, usually using vacuum adsorption or mechanical clamps to ensure the flatness of the PCB.

High-end models support automatic PCB clamping & height adjustment.

(2) Stencil
Made of stainless steel (commonly used) or polyimide (for flexible PCBs), usually 0.1mm - 0.15mm thick.

The shape of the opening determines the accuracy of solder paste deposition (such as 0402, 0201 components require high-precision stencils).

(3) Squeegee
Metal scraper (stainless steel): long life, suitable for high-precision printing (such as BGA, QFN).

Polyurethane scraper (PU): suitable for flexible boards or special solder pastes (such as lead-containing solder paste).

The scraper angle is usually 45°-60°, and the pressure is 5-15N, which affects the quality of solder paste molding.

(4) Vision Alignment System
Standard for high-end models, using CCD camera + optical positioning, with an accuracy of ±10μm.

Automatic calibration of PCB Mark & ​​Steel Mesh Mark to reduce manual errors.

(5) Solder Paste Management System
Automatically add solder paste (supported by some fully automatic models).

Cleaning the bottom of the steel mesh (dry wipe, wet wipe, vacuum adsorption of residual solder paste).


GKG G9 High-end Solder Paste Printing Machine with CCD Digital System 0

GKG G9 High-end Solder Paste Printing Machine with CCD Digital System 1


GKG G9 High-end Solder Paste Printing Machine with CCD Digital System 2