Brand Name: | GKG |
Model Number: | G9+ |
MOQ: | 1 set |
Price: | Negotiable |
Payment Terms: | T/T,Western Union,MoneyGram |
Supply Ability: | 50 sets per month |
GKG G9 High-end Solder Paste Printing Machine with CCD Digital System
Introduction
The G9+ Automatic solder paste printing machine is a high-end machine for SMT high-end application, which can satisfy the printing process requirements of 03015,0.25pitch, high precision and high speed.
Specification
Model | G9+ |
Max PCB Size | 450x340mm |
Min PCB size | 50x50mm |
PCB thickness | 0.4-6mm |
Max board weight | 5kg |
Transport height | 900±40mm |
Board edge gap | 2.5mm |
Board height | 15mm |
Transport direction | L-R,R-L |
Transport speed | max 1500mm/s, program control |
Transport method | One stage |
WIdth adjustment | automatic |
I/O interface | SMEMA |
PCB positioning (support method) | Magnetic pin/support block/manual up-down table |
PCB clamping system |
Patented over the top clamping
|
Side clamping | |
Adsorption function | |
Print snap-off |
0-20mm
|
Print mode
|
one/twice
|
Print Speed
|
10-200mm/sec
|
Print Mode
|
One /Twice
|
Squeegee Type
|
Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
|
Print pressure | 0.5-10kg |
Template fram size | 470*370mm~737*737mm(20-40thickness) |
Cleaning System
|
Droops of rain type cleaning system
|
Reinforced vacuum absorption | |
Dry, wet vacuum three modes | |
Back and forth cleaning | |
CCD FOV
|
10x8mm
|
Fiducial mark types | Standard Fiducial mark shape |
Pad | |
Hole | |
Camera system | Look up/down optics structure |
CCD digital camera | |
Geometry pattern match |
Machine Performance
Model | G9+ |
Repeat position accuracy | ±12.5um@6,CPK≥2.0 |
Print accuracy | ±18um@6,CPK≥2.0 |
Print cycle time | <7.5 sec |
Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision |
Whole Machine Specification
Power supply
|
AC:220±10%,50/60HZ, 3.0KW
|
Air pressure
|
4~6 kgf/cm²
|
Air consumption
|
around 5L/min
|
Operating temperature
|
-20℃~+45℃ |
Operating humidity
|
30%~60%
|
Machine Dimensions(without tower light) |
1172(L) x 1385(W) x 1530 (H)mm
|
Machine Weight
|
Approx: around 1000Kg |
Features
1, CCD digital system, total new optical path system, uniform circular light and high brightness of coaxial light source. With both light source system, brightness can adjust to an infinite loop, allowing different mart point can be easily recognize (including uneven mark point) such as tin plating, copper plating, silver plating, hot air soldering, FPC and various types of different PCB color.
The core components of solder paste printers
(1) Printing platform (PCB Holder)
Used to fix the PCB, usually using vacuum adsorption or mechanical clamps to ensure the flatness of the PCB.
High-end models support automatic PCB clamping & height adjustment.
(2) Stencil
Made of stainless steel (commonly used) or polyimide (for flexible PCBs), usually 0.1mm - 0.15mm thick.
The shape of the opening determines the accuracy of solder paste deposition (such as 0402, 0201 components require high-precision stencils).
(3) Squeegee
Metal scraper (stainless steel): long life, suitable for high-precision printing (such as BGA, QFN).
Polyurethane scraper (PU): suitable for flexible boards or special solder pastes (such as lead-containing solder paste).
The scraper angle is usually 45°-60°, and the pressure is 5-15N, which affects the quality of solder paste molding.
(4) Vision Alignment System
Standard for high-end models, using CCD camera + optical positioning, with an accuracy of ±10μm.
Automatic calibration of PCB Mark & Steel Mesh Mark to reduce manual errors.
(5) Solder Paste Management System
Automatically add solder paste (supported by some fully automatic models).
Cleaning the bottom of the steel mesh (dry wipe, wet wipe, vacuum adsorption of residual solder paste).