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| Place of Origin: | China |
| Brand Name: | HSTECH |
| Certification: | CE |
| Model Number: | HS-700 |
| Minimum Order Quantity: | 1 set |
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| Price: | Negotiable |
| Packaging Details: | Wooden package |
| Delivery Time: | 7~9 work days |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 100 sets per month |
| Product Name: | Mobile Phone BGA Rework Station | Warranty: | 1 Year |
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| Control: | Touch Screen | PLC: | MITSUBISHI |
| Relay Brand: | Schneider | Optoelectronic Switch: | OMRON |
| Material: | Aluminum Alloy | Condition: | New |
| Thickness: | 0.3 - 5mm | Signal: | SMEMA |
| Application: | Electronic Assembly | Color: | Silver |
| Control System: | PLC | OEM/ODM: | Available |
| Total Power: | 2600W | Power Supply: | AC220V |
| Air Pressure: | 4-6bar | Mounting Accuracy: | ±0.01mm |
| Type: | Automatic | Weight: | 30KG |
| High Light: | Temperature Control PCB Handling Equipment,PCB Handling Equipment for Mobile Phone |
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Smart Temperature Control PCB Handling Equipment for Mobile Phone Repair
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
About Packaging
Contact Person: Mr. Rudi Jin
Tel: 86-755-23209382
Fax: 86-755-23209382
