logo

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Solder Paste Machine
Created with Pixso.

PLC Contro Inteligent Solder Paste Thawing Machine Warm Up Machine With Printing Function

PLC Contro Inteligent Solder Paste Thawing Machine Warm Up Machine With Printing Function

Brand Name: HSTECH
Model Number: HS-SP-10N
MOQ: 1 PC
Price: Negotiation
Payment Terms: T/T
Supply Ability: 100 PC/Month
Detail Information
Place of Origin:
China
Certification:
CE,ISO
Product Name:
Solder Paste Thawing Machine
Rated Power Supply:
AC220V / 60Hz
Number Of Working Stations:
10
Emergency Battery Duration:
Up To 8 Hours After Power Failure
Operation Mode:
LCD Touch Screen Control
Warranty:
1 Year
Packaging Details:
Wooden
Supply Ability:
100 PC/Month
Highlight:

PLC control solder paste thawing machine

,

intelligent solder paste warm up machine

,

solder paste machine with printing function

Product Description
PLC Controlled Intelligent Solder Paste Thawing Machine
Professional 10-station warm-up machine with printing function for solder paste and red glue constant-temperature rewarming.
Product Overview
The 10-Station Intelligent Solder Paste Thawing Machine (Model HS-SP-10N) is a professional SMT peripheral device designed for solder paste and red glue constant-temperature rewarming. It is widely used in PCB assembly, electronic manufacturing, SMT production lines, semiconductor packaging, and other industrial applications.
Unlike traditional manual natural thawing, this machine uses intelligent program control to achieve standardized, uniform, and traceable solder paste rewarming. It effectively prevents quality issues such as moisture condensation, solder balling, solder bursting, and BGA/chip voids caused by improper manual thawing.
Working Principle
Solder paste stored in refrigerators is significantly colder than ambient temperature. Direct use without proper rewarming causes condensation inside the solder paste container, damaging flux activity. This leads to solder splashing, solder bead generation, component damage, and high void rates in BGA and chip components during reflow soldering.
Traditional manual thawing relies on worker experience with inconsistent results, leading to unstable soldering quality. Our intelligent solder paste thawing machine simulates natural constant-temperature rewarming, gradually restoring solder paste to optimal active state for excellent printing performance, slump resistance, and release characteristics.
Key Features & Advantages
  • 10 Independent Working Stations - Simultaneous rewarming of 10 cans of 500g solder paste with individual time settings
  • Intelligent Touch Screen Control - LCD touch screen with MCU & PLC integrated control system
  • FIFO Management & Safety Protection - First In First Out function with password verification for material access
  • No Compressed Air Required - Plug-and-play design for easy installation in any workshop area
  • Emergency Backup Battery - Supports up to 8 hours of continuous operation after power failure
  • Data Traceability & Printing Function - Integrated thermal printer and data memory for production quality records
  • Multi-Material Compatibility - Works with lead-free solder paste, leaded solder paste, and SMT red glue
  • Stable Quality & Defect Reduction - Maintains optimal flux activity, reduces BGA and chip void rates
  • High Efficiency & Production Planning - Standardized operation replaces inefficient manual thawing
Technical Specifications
Parameter Specification
Model HS-SP-10N
Rated Power Supply AC220V / 60Hz
Number of Working Stations 10
Operation Mode LCD Touch Screen Control (MCU + PLC)
Applicable Specification 500g standard solder paste can
Emergency Battery Duration Up to 8 hours after power failure
Machine Dimension (L×W×H) 630 × 535 × 330 mm
Net Weight 28KG
Built-in Configuration Thermal Printer + Data Memory
Supported Material Various solder paste / SMT red glue
Application Scenarios
SMT production line, PCB circuit board assembly, electronic component mounting, semiconductor packaging, automotive electronics manufacturing, medical electronics, communication equipment factory, and other precision electronic manufacturing industries.