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Glue Dispensing Machine
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High Speed Single Track Glue Dispensing Machine With Non-contact Injeclion Valve

High Speed Single Track Glue Dispensing Machine With Non-contact Injeclion Valve

Brand Name: HSTECH
Model Number: D450S/D1200S
MOQ: 1 PC
Price: negotiation
Payment Terms: T/T
Supply Ability: 50 PC/Month
Detail Information
Place of Origin:
China
Certification:
CE,ISO
Product Name:
Glue Dispensing Machine
Control Method:
PLC + Motion Control Card
CCD Visual Positioning:
Offset Compensation For Position
Dispensing Capacity:
10CC / 30CC / 50CC / 60CC
Valve Nozzle Cleaning:
Vacuum Cleaning
Warranty:
1 Year
Packaging Details:
Wooden
Supply Ability:
50 PC/Month
Highlight:

single track glue dispensing machine

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non-contact injection valve glue dispenser

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high speed glue dispensing machine

Product Description
High Speed Single Track Glue Dispensing Machine With Non-contact Injection Valve
The D Series glue dispenser features advanced design suitable for various production environments, offering exceptional cost performance. Comprehensive configuration meets dispensing requirements for substrates of different specifications.
Utilizes non-contact injection valve technology to ensure dispensing uniformity, increase productivity, and minimize material loss. Combines multiple dispensing technologies to deliver customized solutions.
Micro Dispensing Performance Specifications
  • Minimum dispensing dot diameter: 0.2mm
  • Minimum line width: 0.25mm
  • Allowable glue overflow width: 0.1mm
  • Minimum dispensing volume: 2nl
Nanoliter-level micro-volume control meets ultra-precision manufacturing demands for microchips, tiny components, and ultra-thin FPCs, effectively reducing defects and improving finished product yield.
Technical Specifications
Item (Model) D450S D1200S
Monolithic Frame L950D1300H1600 (mm) L1800D1300H1600 (mm)
Control Method PLC + Motion Control Card PLC + Motion Control Card
CCD Visual Positioning Offset compensation for position Offset compensation for position
Transport Track High temperature belt conveyor, one-section track (optional three-section track) High temperature belt conveyor, one-section track (optional three-section track)
Step Motor Transport 0.8–15 m/min 0.8–15 m/min
Automatic Amplitude Adjustment Single track: 50~510mm Single track: 50~510mm
X/Y/Z Drive Mode Servo motor + Ball screw (optional linear motor) X-axis linear motor; Y/Z-axis servo motor + ball screw
Maximum Speed 1000 mm/s 1000 mm/s
Operation Accuracy ±0.02 mm ±0.02 mm
Dispensing Stroke X=510mm, Y=510mm, Z=100mm X=1200mm, Y=510mm, Z=100mm
Equipped Valve Quantity Standard one set (optional two sets, double valve spacing electrically adjustable) Standard one set (optional two sets, double valve spacing electrically adjustable)
Valve Heating Ambient temperature ~ 100°C Ambient temperature ~ 80°C, ±3°C
Dispensing Capacity 10CC / 30CC / 50CC / 60CC 10CC / 30CC / 50CC / 60CC
Glue Detection Automatic detection Automatic detection
Valve Nozzle Cleaning Vacuum cleaning Vacuum cleaning
Communication Interface SMEMA SMEMA
Programming Mode Offline or online visual programming Import any patch machine file or online visual programming
Input Voltage 220V 50/60Hz 220V 50/60Hz
Air Pressure 0.6 Mpa 0.6 Mpa
Total Power 2.4 KW 3 KW
Total Weight 650 KG 750 KG
Safety Standard CE CE
Primary Application Fields
The D450S high-speed dispenser serves precision fluid manufacturing across high-end electronics industries, covering 9 core processes:
  1. Underfill: Bottom filling for BGA & stacked POP chips to enhance shock resistance and moisture protection
  2. Precision Conformal Coating: PCB insulation, waterproof and anti-corrosion protective coating
  3. Dam & Fill: Dam construction followed by filling for large-size chips to avoid glue overflow
  4. COB Packaging: Encapsulation for LED COB and camera sensor chips
  5. FPC Component Reinforcement: Strengthen flexible circuit boards and bending areas
  6. Pin Encapsulation: Insulation and sealing for connector terminals
  7. Stack POP Packaging: Micro-volume filling for multi-layer stacked chips
  8. SMT Red Glue Process: High-speed dotting & line drawing with SMT red glue
  9. Hot Melt Adhesive Bonding: Assembly bonding for consumer electronic housings and optical components
Compatible Materials: Underfill glue, UV glue, SMT red glue, hot melt adhesive, conformal coating, epoxy resin, conductive silver paste, protective varnish and other fluid materials.
Standard Equipment & Service Support
  • Standard Delivery Package: Main machine, standard injection valve, temperature control unit, CCD vision system, operation software, standard fixture, user manual and installation tools
  • Installation & Commissioning: On-site machine setup, production line docking, operator training and process parameter optimization
  • Warranty Service: 1-year full machine warranty; extended warranty available for core valves and servo motors; lifetime technical support with 24-hour online fault response
  • Process Support: Free glue selection consultation, dispensing process sample testing and customized solution development
Target Industries
Semiconductor packaging, consumer electronics, smart wearables, automotive electronics, new energy, optical lenses, FPC flexible circuits, medical devices, LED displays, SMT assembly factories
Product Images
High Speed Single Track Glue Dispensing Machine front view showing precision dispensing mechanism
Close-up view of non-contact injection valve and control system on dispensing machine
Dispensing machine in operation with conveyor system and industrial control panel