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Touch Screen High Speed BGA Rework Station 5 Modes Stepping Motor CCD Optical Alignment 0 01mm Positioning Accuracy

Touch Screen High Speed BGA Rework Station 5 Modes Stepping Motor CCD Optical Alignment 0 01mm Positioning Accuracy

Brand Name: HSTECH
Model Number: HS-700
MOQ: 1PC
Price: Negotation
Payment Terms: T/T
Supply Ability: 50 PC/Month
Detail Information
Place of Origin:
China
Certification:
CE,ISO
Total Power:
2600W
Temperature Control:
High Precision K-sensor + Closed Loop Control + Independent Temperature Controller (±1℃ Precision)
Heater Power:
Top Heater 1200W (Max), Bottom Heater 1200W (Max)
Power Supply:
AC 100V / 220V±10% 50/60Hz
Mounting Accuracy:
±0.01mm
Overall Dimensions:
L450mm × W470mm × H670mm
Packaging Details:
Wooden
Supply Ability:
50 PC/Month
Highlight:

Touch Screen BGA Rework Station

,

High Speed PCB Rework Station

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CCD Optical Alignment Rework Station

Product Description
High Speed Touch Screen BGA Rework Station 5 Modes Stepping Motor CCD Color Optical Alignment System 0 01mm Mounting Accuracy BGA Chip Repair Machine SMT Component Rework Equipment For Motherboard IC Chip Repair
Product Introduction

The Manual BGA Rework Station is an advanced, professional-grade repair equipment engineered for the precise removal, placement, and reballing of Ball Grid Array (BGA) components. Designed to meet the rigorous demands of modern electronics manufacturing, this station utilizes a sophisticated "Hot Air + Infrared (IR) Zone Heating" system. By employing independent upper and lower heating modules, the equipment ensures that the entire PCB is evenly preheated before the top heating head concentrates heat on the target chip. This precise thermal management effectively prevents thermal shock, board warpage, and component damage during desoldering and soldering processes. Equipped with an embedded industrial PC and a high-definition touch screen interface, the station allows for real-time temperature curve analysis, giving technicians full control over complex rework tasks with high first-pass success rates.

Key Components
  • Precision Heating System: Uses infrared or hot air to selectively heat BGA components for safe removal and installation
  • Component Removal and Placement Tools: Vacuum nozzles and specialized tools for gentle lifting and positioning
  • Alignment and Vision Systems: Cameras and software ensure precise BGA component alignment during placement
  • Rework Platforms: Secure, temperature-controlled environment for the rework process
Rework Process
  • Preparation: Secure PCB on rework platform and prepare area around target BGA component
  • Heating: Gradual heating melts solder balls for component removal
  • Removal: Careful component lifting without damaging underlying pads or traces
  • Cleaning: PCB pad cleaning to remove residual solder or flux
  • New Component Placement: Precise alignment and placement with reflow heating
Product Features
  • 5 work modes for versatile operation
  • 15" HD LCD monitor for clear visual feedback
  • 7" HD color touch screen interface
  • Stepping motor for precise control
  • CCD color optical alignment system
  • Temperature accuracy within ±1℃
  • Mounting precision within ±0.01mm
  • Repair success rate: 99%+
  • Independent research and development of single-chip control
Technical Specifications
Specification Details
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W (Max), bottom heater 1200W (Max)
Electric Material Driving motor + smart temperature controller + color touch screen
Temperature Control High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor 1 piece
Locating Method V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions L450mm × W470mm × H670mm
PCB Size Max 140mm × 160mm, Min 5mm × 5mm
BGA Size Max 50mm × 50mm, Min 1mm × 1mm
Applicable PCB Thickness 0.3 - 5mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
Mount Chip Weight 150g
Working Modes Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Repair chips / phone motherboard etc
Packaging & Delivery
Item Details
Package 1 set into one wooden carton for safety
External Dimension 450 × 470 × 670mm
Weight Approximately 30kg
Delivery Time Approximately 15-20 working days
Payment Methods D/P, T/T, Western Union, MoneyGram
Port Shenzhen
Shipment Options A. By Courier: 4-7 Working days by special offer
B. By Air: 7 Working days at appointed airport
C. By Sea: 20-25 Working days at appointed port
Application Scenarios

Electronic Motherboard Maintenance

Professional for desoldering soldering and replacement of CPU GPU BGA chips on computer, notebook and desktop motherboards, solving motherboard chip failure, virtual welding and damage problems.

Communication Equipment Repair

Suitable for precision rework of BGA chips on mobile phones, tablet computers, routers and other communication electronic equipment, supporting micro precision component welding and calibration.

SMT Factory Batch Production

Used for batch rework and repair of defective SMT components in electronic production lines, improving product qualification rate and reducing production loss.

Industrial Electronic Maintenance

Applicable to precision maintenance of industrial control boards, automotive electronic circuit boards, medical electronic equipment and other high precision electronic products.

Laboratory and Research Use

Ideal for electronic engineering laboratories, technical schools and research institutions for electronic welding teaching, chip research and precision testing work.

Why Choose Our Product?

Choosing our Manual BGA Rework Station means investing in a perfect balance of precision, reliability, and cost-effectiveness. Unlike basic hot-air tools, our station offers industrial-grade thermal accuracy with a PID data acquisition frequency of just 10ms, significantly outperforming standard 30ms systems in the market. We provide comprehensive after-sales support, including a 3-year warranty for the heating system and lifelong technical assistance. Our equipment is designed with modularity and operator safety in mind, ensuring minimal downtime and maximum repair efficiency. Backed by CE and ISO9001 certifications, our rework station guarantees consistent, high-quality results that meet international manufacturing standards.

Ready to Upgrade Your Rework Capabilities?

Don't let complex BGA repairs slow down your production or compromise your repair quality. Equip your workshop with a rework station that delivers professional-grade precision and unmatched reliability. Contact us today to request a detailed quotation, schedule a product demonstration, or discuss how our Manual BGA Rework Station can be tailored to your specific manufacturing needs. Let's work together to achieve flawless soldering results and maximize your operational efficiency!

Touch Screen High Speed BGA Rework Station 5 Modes Stepping Motor CCD Optical Alignment 0 01mm Positioning Accuracy

Touch Screen High Speed BGA Rework Station 5 Modes Stepping Motor CCD Optical Alignment 0 01mm Positioning Accuracy

Touch Screen High Speed BGA Rework Station 5 Modes Stepping Motor CCD Optical Alignment 0 01mm Positioning Accuracy