Automatic BGA Rework Station CCD Alignment ±0.01mm Mounting Accuracy ±1℃ Temperature Control for PCB Repair

Automatic BGA Rework Station with CCD Color Optical Alignment System ±0.01mm High Mounting Accuracy ±1℃ Precise Temperature Control for Mobile Phone PCB and IC Chip Repair

Product Introduction

BGA Rework Station is a professional automatic BGA rework equipment designed for PCB chip desoldering soldering and reballing process It adopts high precision CCD color optical alignment system to realize accurate positioning of BGA IC chips The machine supports independent temperature control for upper and lower heating zones It can safely remove reball and reattach BGA components without damaging PCB boards or surrounding small components Widely used for IC repair chip replacement and circuit board rework tasks

• 5 work modes: Semi-auto/Manual/Remove/Mount/Weld
• 15" HD LCD monitor with 7" color touch screen interface
• Stepping motor with CCD color optical alignment system
• Temperature accuracy within ±1℃
• Mounting precision within ±0.01mm
• Repair success rate: 99%+
• Independent research and development of single-chip control

• SMT Production Line Rework
  Used for repairing BGA soldering defects, open joints, misalignment, and component replacement.

• Consumer Electronics Repair
  Suitable for motherboards, communication devices, tablets, wearables, and high-density PCBs.

• Automotive Electronics Maintenance
  Supports rework of control modules, sensor boards, power modules, and ECU-related assemblies.

• Industrial and Communication Equipment
  Applicable to industrial control boards, servers, network equipment, and power electronics.

• R&D and Laboratory Use
  Helpful for prototype debugging, component replacement, process verification, and failure analysis.

• Quality Inspection and Training
  Can be used for defect verification, repair training, and process capability evaluation.

• Higher Rework Success Rate
  Precise temperature control and alignment support help reduce repeated rework and component damage.

• Better Thermal Management
  Multi-zone heating and infrared preheating help protect surrounding components and reduce PCB warpage.

• Easy to Operate
  Intuitive interface and stored temperature profiles reduce dependence on operator experience.

• Flexible for Different Products
  Adjustable fixtures, nozzles, and heating parameters make it suitable for multiple PCB sizes and component types.

• Stable Industrial Design
  Built for continuous use in repair stations, SMT workshops, and laboratory environments.

• Customizable Configuration
  Optical alignment, heating power, PCB size, nozzle set, and software functions can be tailored to your needs.

If you need a reliable BGA rework station for SMT repair, component replacement, or process validation, we can help recommend a suitable configuration. Share your PCB size, BGA package type, minimum pitch, required placement accuracy, and power specifications, and we will provide a tailored solution for your production or repair workflow.