Manual BGA Rework Station Industrial Touch Screen 3 Heating Zones CE Certified PCB Repair Equipment

Manual BGA Rework Station with Industrial Touch Screen 3 Heating Zones CE Certification PCB Board IC Chip Soldering Desoldering Repair Equipment

Product Introduction

The Manual BGA Rework Station is a compact and practical rework solution designed for BGA, CSP, QFN, and other surface-mount components. It combines hot-air rework, infrared preheating, manual alignment, and adjustable temperature control to help operators perform BGA desoldering, placement, and soldering with stable results.

This system is suitable for small SMT repair stations, electronics maintenance workshops, R&D laboratories, training centers, and low-to-medium volume rework environments where flexibility and cost efficiency are important.

Product Specifications

Key Features

• Exceptional repair success rate exceeding 99% for BGA rework operations
• Industrial-grade touch screen interface for precise control
• Independent 3 heating zones with hot air heating and infrared preheat (±3℃ accuracy)
• CE certified with double over-temperature protection for safety
• Versatile functionality: solder, desolder, mount, pick and replace chips
• 360-degree rotatable hot air nozzle for optimal positioning
• Advanced temperature control with eight segments for rising temperature, constant time, and temperature slope
• High-accuracy K-type thermocouple close-loop control system
• External sensor for precise temperature detection and real-time curve analysis
• Compatible with BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and other components

• Typical Application Scenarios

  • Electronics Repair Workshops
    Suitable for repairing motherboards, control boards, and consumer electronic devices with BGA components.

  • Small SMT Production Lines
    Useful for occasional rework, component replacement, and process debugging.

  • R&D and Prototype Development
    Helps engineers replace components during board testing and design verification.

  • Training and Education
    Ideal for teaching BGA rework skills, soldering processes, and SMT maintenance procedures.

  • Quality Analysis and Failure Investigation
    Supports component removal and replacement for defect analysis and process validation.

  • Low-Volume Maintenance Centers
    Provides a practical rework solution for environments without high-volume automated rework needs.

Why Choose Our Manual BGA Rework Station?

• Lower Entry Cost
  Delivers essential BGA rework capability without the complexity of a fully automatic system.

• Flexible Manual Operation
  Operators can control alignment, heating, and placement according to actual repair conditions.

• Stable Heating Performance
  Independent preheating and hot-air modules help improve soldering consistency.

• Suitable for Multiple Components
  Supports various BGA, CSP, and QFN packages with appropriate nozzles and fixtures.

• Easy Maintenance
  Simple structure and accessible components help reduce daily upkeep effort.

• Customizable Configuration
  Heating power, PCB fixture, nozzle set, and power specifications can be tailored to your workflow.

Start with a Practical BGA Rework Solution

If you need a reliable and cost-effective manual BGA rework station for repair, training, or light production rework, we can help recommend a suitable configuration. Share your typical PCB size, BGA package type, heating requirements, and power specifications, and we will provide a practical solution for your rework needs.

Packaging & Documentation