Modularized Design PUR Jetting Valve HS-PF-PUR30CC High Precision Dispensing

odularized Design PUR Jetting Valve HS-PF-PUR30CC For High Precision Hot Melt Adhesive Non Contact Glue Dispensing

Product Introduction

The HS-PF-PUR30CC is a high-performance PUR jetting valve designed for precision hot-melt adhesive dispensing in SMT, PCBA, semiconductor packaging, LED assembly, and consumer electronics manufacturing. It supports non-contact jetting of PUR, hot-melt adhesive, and other high-viscosity fluids, helping achieve consistent dot size, stable line width, and reliable bonding performance in automated production lines.

With a 30CC heated adhesive chamber and integrated temperature control design, the valve maintains stable adhesive viscosity during continuous operation. This helps reduce stringing, dripping, and volume fluct caused by temperature changes, making it suitable for high-speed dispensing, underfill, edge bonding, dam-and-fill, and structural bonding applications.

Principle & Control

1.The PUR injection valve consists of a drum heating module, a pressurized cap module, a nozzle heating module, a flow path module, a valve body module and a heat dissipation module.

2.The barrel heating module carries the barrel as well as the one-stage heating with controllable temperature. The initial heating of the gel is completed.

3.The pressurized cap module seals and pressurizes the drum and controls the output pressure through the controller.

4.The heat dissipation module dissipates heat and reduces noise from the valve body.

5.The piezoelectric injection valve adopts a modular design, the part in contact with the gel is designed as the runner module, and the part not in contact with the gel is designed as the valve body module.

6. The flow path module can be changed to meet the dispensing requirements in different applications.

7.Nozzle diameters in series (from 40µm to 500µm).

8.The nozzles are categorized into flat jet type, needle type, and extension type.

9.Runner modules need to be cleaned regularly in an ultrasonic cleaner. Seals must not be immersed in organic solvents. Special tools are required to clean the nozzles to prevent damage to the nozzles.

Jet Valve Controller

1. The touch screen controls the piezoelectric injection valve and dispensing system, supports MES communication, powerful, safe and reliable.

2. The touch screen adopts graphic control mode, the components of dispensing system and the control display function are displayed graphically, which is concise and intuitive.

3.Nozzle heating device: The nozzle is required to be heated to a suitable temperature before dispensing. The heating device adopts one-stage heating mode.

4.Heating at the nozzle maintains the constant temperature of the gel to meet the best performance of the gel. The best performance of the colloid.

Nozzle and barrel heating

1.The nozzle is required to be heated to a suitable temperature before dispensing. The heating device adopts two-stage heating mode.

2.Heating at the nozzle maintains the constant temperature of the gel to meet the best performance of the gel. The best performance of the colloid.

Specification

Advantages

1.The barrel heating is suitable for 30cc, 100cc, 300cc hot melt adhesive with different volume.

2. Modularized design, easy to replace parts, simple debugging, wide range of process applications.

3. Spray volume can be accurate to 0.3nL, spray adhesive spot consistency accuracy of up to 98%.

4. Minimum 0.17mm line width, minimum 0.15mm spot diameters of hot melt glue spraying process can be realized.

5. Can match any motion platform on the market.

Application Scenarios

• SMT and PCBA Assembly
  Suitable for component pre-fixing, structural bonding, and localized adhesive dispensing on PCBs and PCBA boards.
• PUR Hot-Melt Bonding
  Used for bonding processes that require heated PUR adhesive, such as frame sealing, edge bonding, and assembly fixation.
• Consumer Electronics Manufacturing
  Ideal for smartphones, tablets, wearables, cameras, and small electronic devices requiring precise adhesive placement.
• LED and Lighting Module Assembly
  Supports adhesive dispensing for LED modules, light bars, heat sinks, and optical component fixation.
• Semiconductor and Chip Packaging
  Can be applied in underfill, dam-and-fill, edge sealing, and protective encapsulation processes.
• Automotive Electronics and Industrial PCBA
  Helps improve bonding consistency for control boards, sensor modules, power modules, and high-reliability assemblies.

Why Choose Our HS-PF-PUR30CC PUR Jetting Valve

• Specialized for PUR and Hot-Melt Applications
  The valve is designed to handle heated high-viscosity adhesives, making it suitable for demanding PUR dispensing processes.
• Stable Jetting Quality
  Integrated heating and flow path design help maintain adhesive stability, reducing stringing, dripping, and inconsistent dot volume.
• Non-Contact Process Protection
  Jetting dispensing minimizes nozzle contact with the workpiece, helping protect sensitive components and uneven surfaces.
• Easy Integration into Automated Lines
  Can be mounted on standard dispensing platforms and controlled through dispensing controllers or automation systems.
• Practical 30CC Capacity
  The 30CC chamber balances continuous operation time and equipment footprint, supporting efficient production without frequent refills.
• Maintenance-Friendly Design
  Modular components allow easier cleaning, nozzle replacement, and daily maintenance, helping reduce production interruptions.
• Technical Support Available
  We can help confirm suitable nozzles, temperature settings, controller matching, and process parameters according to your adhesive type and application.

Contact Us for a Quote

If you need a reliable PUR jetting valve for hot-melt adhesive dispensing, the HS-PF-PUR30CC can be a strong choice for automated bonding and precision dispensing applications.

Please share your adhesive type, viscosity, required dot size or line width, dispensing speed, working temperature, and machine interface requirements. We will help recommend a suitable configuration and provide a quotation accordingly.