igh Speed Aluminum Jetting Valve HS PF 100 HS PF 200 Controlled Volume Dispensing Valve

High Speed Aluminum Jetting Valve HS PF 100 HS PF 200 Controlled Volume Precision Fluid Dispensing Valve For Industrial Glue Dispensing

The HS-PF-100 and HS-PF-200 Jetting Valves are high-speed, non-contact dispensing valves designed for precision fluid control in SMT, PCBA, semiconductor packaging, LED assembly, and consumer electronics manufacturing. By generating fast pressure pulses, the jetting valve ejects adhesive or solder paste in micro-droplets without touching the substrate, helping achieve consistent dot size, stable line width, and high dispensing efficiency.

The HS-PF series is suitable for automated dispensing machines, robotic arms, and XYZ motion platforms. It can handle common SMT fluids such as solder paste, UV adhesive, epoxy, underfill, conformal coating, silver paste, and other low- to medium-viscosity materials, making it a flexible solution for high-speed dotting, line dispensing, encapsulation, and bonding processes.

1. High-speed jet valve is a high speed non-contact jet valve driven by pneumatic pressure and controlled by solenoid valve, breaking through the traditional contact dispensing technology, no need to move the Z-axis when working, the spring pressure in the cavity is adjustable pneumatic pressure is used to drive, non-contact jet dispensing, high precision, fast speed solenoid valve control, fine scale micrometer to adjust the stroke, the spring pressure in the cavity is adjustable air-cooled way of physical cooling and cooling of the valve, which greatly improves the performance and life of the valve. Improve the performance and life of the valve.
2. Compact exterior design, flexible equipment installation, fast maintenance and servicing.

1. The touch screen controls the piezoelectric injection valve and dispensing system, supports 485 communication, powerful, safe and reliable.
2. The touch screen adopts graphic control mode, the components of dispensing system and the control display function are displayed graphically, which is concise and intuitive.
3. Nozzle heating device:The nozzle is required to be heated to a suitable temperature before dispensing. The heating device adopts one-stage heating mode.
4. Heating at the nozzle maintains the constant temperature of the gel to meet the best performance of the gel. The best performance of the colloid.

• SMT and PCBA Dispensing
  Suitable for solder paste jetting, component fixation, adhesive dotting, and conformal coating on PCBs and PCBA boards.
• Semiconductor and Chip Packaging
  Can be used for underfill, dam-and-fill, edge sealing, and precision encapsulation in semiconductor and electronic packaging processes.
• LED and Optical Module Assembly
  Supports adhesive dispensing for LED modules, optical lenses, light bars, and small electronic assemblies.
• Consumer Electronics Manufacturing
  Ideal for smartphones, wearables, cameras, TWS earphones, and small devices requiring precise and fast fluid placement.
• Automotive and Industrial Electronics
  Helps improve dispensing consistency for sensor modules, control boards, power modules, and high-reliability assemblies.
• R&D and Flexible Production
  Suitable for prototype development, small-batch production, and process optimization where flexible dispensing parameters are required.

• High-Speed Non-Contact Dispensing
  The jetting principle helps protect sensitive components and uneven surfaces while maintaining fast dispensing performance.
• Strong Process Flexibility
  Compatible with multiple dispensing fluids and automation platforms, making it easier to adapt to different production requirements.
• Consistent Dispensing Quality
  Designed to support stable droplet formation and repeatable fluid output, helping reduce dot size variation and process defects.
• Easy to Integrate and Maintain
  Modular design supports nozzle replacement, fluid path cleaning, and integration with existing dispensing equipment.
• Suitable for Automated Production Lines
  Can be mounted on standard dispensing machines and motion platforms, supporting semi-automatic or fully automatic workflows.
• Technical Support Available
  We can help confirm suitable models, nozzles, fluid compatibility, controller matching, and process parameters based on your application.

If you need a high-speed jetting valve for SMT dispensing, solder paste jetting, or precision adhesive application, the HS-PF-100 and HS-PF-200 can be practical options for your production line.

Please share your fluid type, viscosity, required dot size or line width, dispensing speed, working pressure, and machine interface requirements. We will help recommend a suitable model and provide a quotation accordingly.