products details

Home Products

15''HD LCD Monitor Mobile Phone BGA Rework Station with 5 Modes Stepping Motor and CCD Color Optical Alignment System

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Thickness:

0.3 - 5mm

Signal:

SMEMA

Total Power:

2600W

Power Supply:

AC220V

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

15''HD LCD Monitor BGA Rework Station

5 Modes Stepping Motor BGA Chip Repair Machine

CCD Color Optical Alignment System PCB Handling Equipment

Product Description

15" HD LCD Monitor Mobile Phone BGA Rework Station

Professional-grade BGA rework station featuring 5 work modes, stepping motor technology, and CCD color optical alignment system for precision mobile phone motherboard repair.

Key Features

5 versatile work modes for flexible operation

15" HD LCD monitor for clear visual feedback

7" HD color touch screen interface

Precision stepping motor control

CCD color optical alignment system

Temperature accuracy within ±1℃

Mounting precision within ±0.01mm

99%+ repair success rate

Independent research and development of single-chip control

Technical Specifications

Model	HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W (Max), bottom heater 1200W (Max)
Electric Material	Driving motor + smart temperature controller + color touch screen
Temperature Control	High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor	1 piece
Locating Method	V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions	L450mm × W470mm × H670mm
PCB Size Range	Max 140mm × 160mm, Min 5mm × 5mm
BGA Size Range	Max 50mm × 50mm, Min 1mm × 1mm
Applicable PCB Thickness	0.3 - 5mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG
Mount Chip Weight	150g
Working Modes	Five: Semi-auto/Manual/Remove/Mount/Weld
Application	Chips / phone motherboard repair