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High Precision K-sensor BGA Rework Station with 7' HD Color Touch Screen and ±0.01mm Mounting Accuracy

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

PLC:

MITSUBISHI

Relay Brand:

Schneider

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Condition:

New

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Color:

Silver

Control System:

PLC

OEM/ODM:

Available

Total Power:

2600W

Power Supply:

AC220V

Air Pressure:

4-6bar

Mounting Accuracy:

±0.01mm

Type:

Automatic

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

High Precision K-sensor BGA Rework Station

7' HD Color Touch Screen BGA Chip Repair Machine

±0.01mm Mounting Accuracy Mobile Phone BGA Rework Station

Product Description

High Precision K-sensor Mobile Phone BGA Reballing Station

Advanced BGA rework station featuring a 7-inch HD color touch screen and precision K-sensor technology for professional mobile phone motherboard repair.

Key Features

5 modes stepping motor CCD color align system
High precision K-sensor with closed loop control
7-inch HD color touch screen interface
Multiple working modes: Semi-auto/Manual/Remove/Mount/Weld
Laser centering and positioning system

Technical Specifications

Model	HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W (Max), bottom heater 1200W (Max)
Temperature Control	High precision K-sensor + closed loop control (±1℃ precision)
PCB Size Range	Max 140mm×160mm, Min 5mm×5mm
BGA Size Range	Max 50mm×50mm, Min 1mm×1mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG