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5 Modes Stepping Motor CCD Color Align System BGA Rework Station with ±0.01mm Mounting Accuracy for Mobile Phone BGA Chip Repair

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

PLC:

MITSUBISHI

Relay Brand:

Schneider

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Condition:

New

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Color:

Silver

Control System:

PLC

OEM/ODM:

Available

Total Power:

2600W

Power Supply:

AC220V

Air Pressure:

4-6bar

Mounting Accuracy:

±0.01mm

Type:

Automatic

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

±0.01mm Mounting Accuracy BGA Rework Station

5 Modes Stepping Motor BGA Chip Repair Machine

CCD Color Align System Mobile Phone BGA Rework Station

Product Description

5 Modes Stepping Motor CCD Color Align System Mobile Phone BGA Rework Station

High precision BGA rework station featuring advanced CCD color alignment system with five operational modes for professional mobile phone motherboard repair.

Technical Specifications

Model	HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W (Max), bottom heater 1200W (Max)
Electrical Components	Driving motor + smart temperature controller + color touch screen
Temperature Control	High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor	1 piece
Positioning Method	V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions	450mm × 470mm × 670mm (L×W×H)
PCB Size Range	Max 140mm×160mm, Min 5mm×5mm
BGA Size Range	Max 50mm×50mm, Min 1mm×1mm
PCB Thickness	0.3 - 5mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG
Maximum Chip Weight	150g
Working Modes	Five: Semi-auto/Manual/Remove/Mount/Weld
Application	Chips / phone motherboard repair

Key Features

BGA optical alignment system for fast and accurate positioning
Import drive motor, PLC intelligent temperature controller, true color touch screen with external high-definition display
Precision temperature control with K-type thermocouple closed-loop system (±1℃ accuracy)
Versatile positioning with V-slot PCB bracket featuring X, Y adjustment and universal fixture configuration
User-friendly operation with intuitive controls
Compatible with all models of mobile phones for comprehensive repair capabilities

Packaging Details