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High Precision K-Sensor BGA Rework Station with ±0.01mm Mounting Accuracy and ±1℃ Temperature Accuracy for Mobile Phone Chip Repair

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

PLC:

MITSUBISHI

Relay Brand:

Schneider

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Condition:

New

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Color:

Silver

Control System:

PLC

OEM/ODM:

Available

Total Power:

2600W

Power Supply:

AC220V

Air Pressure:

4-6bar

Mounting Accuracy:

±0.01mm

Type:

Automatic

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

High Precision K-Sensor BGA Rework Station

±0.01mm Mounting Accuracy BGA Chip Repair Machine

±1℃ Temperature Accuracy Mobile Phone BGA Rework Station

Product Description

High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

5 Modes Stepping Motor CCD Color Align System

Professional mobile phone BGA rework station featuring advanced temperature control and precision alignment for chip repair applications.

Technical Specifications

Model	HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W (Max), bottom heater 1200W (Max)
Electric Material	Driving motor + smart temperature controller + color touch screen
Temperature Control	High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor	1 piece
Locating System	V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions	L450mm × W470mm × H670mm
PCB Size Range	Max 140mm×160mm / Min 5mm×5mm
BGA Size Range	Max 50mm×50mm / Min 1mm×1mm
PCB Thickness	0.3 - 5mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG
Mount Chip Weight	150g
Working Modes	Five: Semi-auto / Manual / Remove / Mount / Weld
Applications	Chips / phone motherboard repair

Key Features

Dual heating zones with ±1℃ temperature precision control, simultaneous top and bottom heating with 8 independent temperature control segments
Hot air district heating for BGA and PCB simultaneously, with flexible combination of upper and lower heating elements
High precision K-type thermocouple closed-loop control with PID parameter self-setting system
Real-time temperature curve display with analysis function and multi-group user data storage
External measurement interface for precise temperature testing and on-screen curve analysis and correction

Product Images