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BGA Rework Station
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Mobile Phone BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and ±1℃ Temperature Accuracy

Mobile Phone BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and ±1℃ Temperature Accuracy

Brand Name: HSTECH
Model Number: HS-700
MOQ: 1 set
Price: Negotiable
Payment Terms: T/T,Western Union
Supply Ability: 100 sets per month
Detail Information
Place of Origin:
China
Certification:
CE
Product Name:
Mobile Phone BGA Rework Station
Warranty:
1 Year
Control:
Touch Screen
PLC:
MITSUBISHI
Relay Brand:
Schneider
Optoelectronic Switch:
OMRON
Material:
Aluminum Alloy
Condition:
New
Thickness:
0.3 - 5mm
Signal:
SMEMA
Application:
Electronic Assembly
Color:
Silver
Control System:
PLC
OEM/ODM:
Available
Total Power:
2600W
Power Supply:
AC220V
Air Pressure:
4-6bar
Mounting Accuracy:
±0.01mm
Type:
Automatic
Weight:
30KG
Packaging Details:
Wooden package
Supply Ability:
100 sets per month
Highlight:

±0.01mm Mounting Accuracy BGA Rework Station

,

CCD Color Optical Alignment System Mobile Phone BGA Rework Station

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±1℃ Temperature Accuracy BGA Chip Repair Machine

Product Description
Advanced Stepping Motor CCD Color Align System for Mobile Phone BGA Handling Station
5 Modes Stepping Motor CCD Color Align System Mobile Phone BGA Rework Station
Technical Specifications
Mobile Phone BGA Rework StationModel: HS-700
Power SupplyAC 100V / 220V±10% 50/60Hz
Total Power2600W
Heater PowerTop heater 1200W(Max), bottom heater 1200W(Max)
Electric MaterialDriving motor + smart temperature controller + color touch screen
Temperature ControlHigh precision K-sensor + closed loop control + independent temperature controller (precision can reach ±1℃)
Sensor1 piece
Locating MethodV shape PCB support + external universal fixture + laser light for centering and positioning
Overall DimensionL450mm × W470mm × H670mm
PCB SizeMax 140mm × 160mm, Min 5mm × 5mm
BGA SizeMax 50mm × 50mm, Min 1mm × 1mm
Applicable PCB Thickness0.3 - 5mm
Mounting Accuracy±0.01mm
Machine Weight30KG
Mount Chip Weight150g
Working ModesFive: Semi-auto/Manual/Remove/Mount/Weld
UsageRepair chips / phone motherboard etc.
Key Features
  • 5 work modes for versatile operation
  • 15" HD LCD monitor for clear visual feedback
  • 7" HD color touch screen for intuitive control
  • Stepping motor for precise movement control
  • CCD color optical alignment system for accurate positioning
  • Temperature accuracy within ±1℃
  • Mounting precision within ±0.01mm
  • Repair success rate: 99%+
  • Independent research and development of single-chip control
Precision Optical Alignment System
High definition and adjustable CCD color optical alignment system with beam split, amplification, lessening, fine adjustment and auto focus capabilities. Features automatic color aberration resolution and brightness adjustment, adjustable image contrast. Equipped with 15" high definition LCD monitor for optical alignment system BGA rework station.
Multi-functional and Humanized Operation System
Adopting HD touch human-machine interface with upper heating head and mounting head designed as 2-in-1 unit. Provides multiple titanium alloy BGA tuyere options that rotate 360 degrees for easy installation and replacement. X, Y and R angle adopted micrometer fine-tuning for accuracy locating with precision reaching ±0.01mm.
Superior Safety Protection Function
Includes alarm function that automatically signals after BGA welding completion. Features double over-temperature protection with automatic circuit power-off in case of temperature abuse. Temperature parameters include password protection to prevent unauthorized modifications.
Product Images
Mobile Phone BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and ±1℃ Temperature Accuracy 0 Mobile Phone BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and ±1℃ Temperature Accuracy 1 Mobile Phone BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and ±1℃ Temperature Accuracy 2