products details

Home Products

High Precision BGA Rework Station with CCD Color Optical Alignment System and ±0.01mm Mounting Accuracy for Mobile Phone BGA Chip Repair

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

PLC:

MITSUBISHI

Relay Brand:

Schneider

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Condition:

New

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Color:

Silver

Control System:

PLC

OEM/ODM:

Available

Total Power:

2600W

Power Supply:

AC220V

Air Pressure:

4-6bar

Mounting Accuracy:

±0.01mm

Type:

Automatic

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

±0.01mm Mounting Accuracy BGA Rework Station

CCD Color Optical Alignment System BGA Chip Repair Machine

±1℃ Temperature Accuracy PCB Handling Equipment

Product Description

High Precision CCD Color Align System with Stepping Motor for Mobile Phone BGA Rework

Advanced 5-mode stepping motor CCD color alignment system designed for precision mobile phone BGA rework operations with exceptional accuracy and reliability.

Technical Specifications

Specification	Details
Model	HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W (Max), bottom heater 1200W (Max)
Electrical Components	Driving motor + smart temperature controller + color touch screen
Temperature Control	High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor	1 piece
Positioning Method	V-shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions	L450mm × W470mm × H670mm
PCB Size	Max 140mm × 160mm, Min 5mm × 5mm
BGA Size	Max 50mm × 50mm, Min 1mm × 1mm
Applicable PCB Thickness	0.3 - 5mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG
Mount Chip Weight	150g
Working Modes	Five: Semi-auto/Manual/Remove/Mount/Weld
Application	Chips / phone motherboard repair