Brand Name: | HSTECH |
Model Number: | HS-700 |
MOQ: | 1 set |
Price: | Negotiable |
Payment Terms: | T/T, Western Union, MoneyGram |
Supply Ability: | 100 sets per month |
5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station
Specification
Mobile Phone BGA Rework Station | Model:HS-700 |
Power Supply | AC 100V / 220V±10% 50/60Hz |
Total power | 2600W |
Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
Electric material | Driving motor + smart temp. controller + color touch screen |
Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
Sensor | 1pcs |
Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
Overall dimension | L450mm*W470mm*H670mm |
PCB size | Max 140mm*160mm Min 5mm*5mm |
BGA size | Max 50mm*50mm Min 1mm*1mm |
Applicable PCB thickness | 0.3 - 5mm |
Mounting accuracy | ±0.01mm |
Weight of machine | 30KG |
Mount chip weight | 150g |
Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
Usage Repair | chips / phone motherboard etc |
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
Main configuration
1.Five working modes
2.independently developed microcontroller control
3.stepping motor
4.7.2 inch true color touch screen
5.Infrared laser lamp positioning6.0ptical alignment and precise installation
Advantages
1.Automatic suction and installation.
2.The built-in vacuum pumprotates by 90 ° to accurately adjust andinstall the suction nozzle.
3.Built in pressure testing device,upon detecting pressure,the upper heating head automaticallystops descending to preventPCB and BGA from being crushed.
4.Different vacuum suction cupswith different nozzles for different chips.
About Packaging