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BGA Rework Station
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Automatic BGA Rework Station with ±0.01mm Mounting Accuracy MCGS Touch Screen Control and Laser Positioning

Automatic BGA Rework Station with ±0.01mm Mounting Accuracy MCGS Touch Screen Control and Laser Positioning

Brand Name: HSTECH
Model Number: HS-620
MOQ: 1 set
Price: Negotiable
Payment Terms: T/T,Western Union
Supply Ability: 100 sets per month
Detail Information
Place of Origin:
China
Certification:
CE
Product Name:
BGA Rework Station
Warranty:
1 Year
Control:
Touch Screen
PLC:
MITSUBISHI
Relay Brand:
Schneider
Optoelectronic Switch:
OMRON
Material:
Aluminum Alloy
Condition:
New
Thickness:
0.3 - 5mm
Signal:
SMEMA
Application:
Electronic Assembly
Color:
Silver
Control System:
PLC
OEM/ODM:
Available
Total Power:
2600W
Power Supply:
AC220V
Air Pressure:
4-6bar
Mounting Accuracy:
±0.01mm
Type:
Automatic
Weight:
30KG
Packaging Details:
Wooden package
Supply Ability:
100 sets per month
Highlight:

±0.01mm Mounting Accuracy BGA Rework Station

,

MCGS Touch Screen Control BGA Chip Repair Machine

,

Laser Positioning PCB Handling Equipment

Product Description
PCB Handling Equipment with Laser Positioning and MCGS Touch Screen Control
Manual & Automatic Laser Position MCGS Touch Screen Control BGA Rework Station
Specifications
BGA Rework Station Model: HS-620
Power Supply AC 220V±10% 50/60Hz
Total Power 3500W
Heater Power Upper temp.zone 1200W, second temp.zone 1200W, IR temp.zone 2700W
Electric Material Driving motor + PLC smart temp.controller + color touch screen
Temperature Control Independent temp.controller, precision can reach ±1℃
Temperature Interface 1pcs
Locating Way V shape slot, PCB support jigs can adjust, laser light do fast centering and position
Overall Dimension L650mm * W630mm * H850mm
PCB Size Max 450mm * 390mm Min 10mm * 10mm
BGA Size Max 80mm * 80mm Min 1mm * 1mm
Weight of Machine 60KG
Usage Repair chips / phone motherboard etc
Key Features
  • Automatic & Manual operation system
  • 5 million CCD camera optical alignment system mount precision: ±0.01mm
  • MCGS touch screen control
  • Laser positioning system
  • Repair success rate 99.99%
Technical Advantages
Upper and Lower Heaters
Integrated design of hot air heating head and mounting head
Three independent heating zones with fast heating and large temperature difference between repair platform and nearby BGA
Does not affect surrounding BGA during heating process
Bottom Heater
Uses ceramic heating plate technology
Provides uniform heating across the PCB board
Infrared Heating Area Control
Control left and right heating plates independently
Minimizes power output for energy efficiency
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