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PCB Handling Equipment with Laser Positioning and MCGS Touch Screen Control

Brand Name:	HSTECH
Model Number:	HS-620
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T, Western Union, MoneyGram
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

PLC:

MITSUBISHI

Relay Brand:

Schneider

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Condition:

New

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Color:

Silver

Control System:

PLC

OEM/ODM:

Available

Total Power:

2600W

Power Supply:

AC220V

Air Pressure:

4-6bar

Mounting Accuracy:

±0.01mm

Type:

Automatic

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Product Description

Manual & Automatic Laser Position MCGS Touch Screen Control BGA Rework Station

Specification

BGA Rework Station	Model:HS-620
Power Supply	AC 220V±10% 50/60Hz
Total power	3500W
Heater power	Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
Electric material	Driving motor+PLC smart temp.controller+color touch screen
Temperature	control independent temp.controller,the precision can reach ±1℃
Temperature Interface	1pcs
Locating way	V shape slot,PCB support jigs can adjust,laser light do fast centering and position
Overall dimension	L650mmW630mmH850mm
PCB size	Max 450mm390mm Min 10mm10mm
BGA size	Max 80mm80mm Min 1mm1mm
Weight of machine	60KG
Usage Repair	chips / phone motherboard etc

Features

1.Automatic&Manual operation system.

2. 5 million CCD camera optical alignment system mount precision:±0.01mm.

3.MCGS touch screen control.

4.Laser position.

5.Repair success rate 99.99%.

Advantages

Upper and lower heaters

1.integrated design of hot air heating head and mounting head.
2.lt has three independent heating zoneswith fast heating and a large temperature differencebetween the repair platform and the nearby. BGAwhich does not affect the surrounding BGA during heating.

Bottom heater

1.Use ceramic heating plate.
2. Make the heating of the PCB board more unifo.

Infrared heating area control switch

Control the left and right heatingplates to minimize poweroutput and save energy

About Packaging