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BGA Rework Station
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HS-800 BGA Rework Station with ±0.01mm Mounting Accuracy and Hot Air Mounting Head Integration for PCB Handling

HS-800 BGA Rework Station with ±0.01mm Mounting Accuracy and Hot Air Mounting Head Integration for PCB Handling

Brand Name: HSTECH
Model Number: HS-800
MOQ: 1 set
Price: Negotiable
Payment Terms: T/T,Western Union
Supply Ability: 100 sets per month
Detail Information
Place of Origin:
China
Certification:
CE
Product Name:
BGA Rework Station
Warranty:
1 Year
Control:
Touch Screen
PLC:
MITSUBISHI
Relay Brand:
Schneider
Optoelectronic Switch:
OMRON
Material:
Aluminum Alloy
Condition:
New
Thickness:
0.6-4.0mm
Signal:
SMEMA
Application:
Electronic Assembly
Color:
Silver
Control System:
PLC
OEM/ODM:
Available
Power Consumption:
200W
Power Supply:
AC220V
Air Pressure:
4-6bar
Speed:
200-300pcs/min
Type:
Automatic
Weight:
220/240KG
Packaging Details:
Wooden package
Supply Ability:
100 sets per month
Highlight:

Integration Head PCB Handling Equipment

,

PCB Handling Equipment with Mounting Head

Product Description
PCB Handling Equipment HS-800 BGA Rework Station with Hot Air Mounting Head Integration
Advanced BGA rework station featuring integrated hot air and mounting head technology for precision soldering and desoldering operations.
Technical Specifications
Specification Details
BGA Rework Station Model HS-800
Heater Power Top heater 1200W (Max), bottom heater 1200W (Max)
Bottom Pre-Heating IR 5000W
Temperature Control K-type thermocouple, closed loop control
Locating Method Outer or location hole
Overall Dimensions L970mm × W700mm × H830mm
PCB Size W650mm × D610mm
BGA Size Range Max 80mm × 80mm, Min 1mm × 1mm
Applicable PCB Thickness 0.3 - 5mm
Mounting Accuracy ±0.01mm
Machine Weight 140KG
Key Features
Integrated hot air head and mounting head design with automatic soldering and desoldering functions
Upper heaters utilize hot air system for faster heating, even temperature distribution, and rapid cooling (50-80°C)
Three independent heaters with synchronized automatic movement for comprehensive IR coverage
High-precision slider system ensures accurate BGA and PCB mounting alignment
German-imported quality heating materials in bottom preheating table
Integrated X-axis movement for preheating table, clamping device, and cooling system
Motor-controlled X and Y axis movement for faster, more convenient alignment
Dual rocker control for camera and heating platforms ensuring precision alignment
Built-in vacuum pump with 360° rotation and fine-adjusting suction nozzle
Automatic BGA pickup and mounting height detection with pressure control
High-resolution color optical vision system with split vision and auto-focus
10-segment temperature control with programmable temperature profiles
Multiple alloy nozzle sizes with full-angle positioning capability
Five thermocouple ports for real-time multi-point temperature monitoring
Solid operation display for reliable temperature control monitoring
Applications
Suitable for mobile phones, hard drives, keyboards, electronic toys, computers, DVD players, plastics, electrical appliances, communication equipment, toys, electronic processing, motors, tablets, notebook computers, digital cameras, remote controls, walkie-talkies, and various electronic components.
Product Gallery
Manufacturer Information

Shenzhen Hansome Technology Co., Ltd is a professional SMT board handling equipment manufacturer specializing in Loaders, Unloaders, Buffer Conveyors, Soldering Machines, Screw Fastening Machines, PCB Depaneling Machines, and related equipment.

We are a high-tech enterprise with independent intellectual property rights, primarily engaged in the research, development, production, and sales of SMT/THT production line board handling equipment.

With over 10 years of professional SMT industry experience, we maintain strict production, inspection, debugging, and packaging processes. We provide comprehensive pre-sales, in-sales, and after-sales services with professional QC personnel ensuring equipment and spare parts quality. All equipment undergoes thorough testing and debugging before shipment.