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| Place of Origin: | China |
| Brand Name: | HSTECH |
| Certification: | CE |
| Model Number: | HS-800 |
| Minimum Order Quantity: | 1 set |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Wooden package |
| Delivery Time: | 7~9 work days |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 100 sets per month |
| Product Name: | BGA Rework Station | Warranty: | 1 Year |
|---|---|---|---|
| Control: | Touch Screen | PLC: | MITSUBISHI |
| Relay Brand: | Schneider | Optoelectronic Switch: | OMRON |
| Material: | Aluminum Alloy | Condition: | New |
| Thickness: | 0.6-4.0mm | Signal: | SMEMA |
| Application: | Electronic Assembly | Color: | Silver |
| Control System: | PLC | OEM/ODM: | Available |
| Power Consumption: | 200W | Power Supply: | AC220V |
| Air Pressure: | 4-6bar | Speed: | 200-300pcs/min |
| Type: | Automatic | Weight: | 220/240KG |
| High Light: | Integration Head PCB Handling Equipment,PCB Handling Equipment with Mounting Head |
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PCB Handling Equipment HS-800 BGA Rework Station with Hot Air Mounting Head Integration
Specification
| BGA Rework Station | Model:HS-800 |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Bottom Pre-Heating | IR 5000w |
| Temperature control | K-type thermocouple,close loop control |
| Locating way | Outer or location hole |
| Overall dimension | L970mm*W700mm*H830mm |
| PCB size | W650*D610mm |
| BGA size | Max 80mm*80mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 140KG |
Features
1.Hot air head and mounting head integration design, with auto soldering and desoldering functions.
2.Upper heaters adopt hot air system, heating faster, temperature evenness, cooling faster. (the temperature can be up to 50 to 80 centigrade).
3.Independent 3 heaters. upper and lower heaters can realize move synchronously and automatically, can reach IR every position. Lower heater zone can remove up and down, support PCB board.
4.PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.
5.Unique bottom preheating table made of Germany-imported good quality heating materials plated.
6.Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.
7.X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient.
8. Double rocker control the camera and upper and lower heating platform to make sure the alignment precision accuracy.
9.Inbuilt vacuum pump, rotate 360 in angel; fine-adjusting mounting suction nozzle.
10.Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; zero pressure available to smaller BGA pickup and mounting.
11.Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom; reworkable max. BGA size 80*80MM;
12.With 10 segments of temperature up (down) and 10 segments of constant temperature control, can save many segments of temperature.
13.Many sizes of alloy nozzle, easy for replacement; can locate at all angle.
14.With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.
15.With a solid operation display function to make the temperature control more reliable.
Application
Suitable for mobile phones, hard drives, keyboards, electronic toys, computers, DVD, dots, plastics, electrical appliances, communication equipment, electrical appliances, toys, electronic processing, motors, motors, parts, tablets, notebook computers, digital cameras, remote controls, walkie-talkie, etc.
About Packaging
Contact Person: Mr. Rudi Jin
Tel: 86-755-23209382
Fax: 86-755-23209382
