products details

Home Products

Automatic BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and ±1℃ Temperature Control for Mobile Phone PCB Repair

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

PLC:

MITSUBISHI

Relay Brand:

Schneider

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Condition:

New

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Color:

Silver

Control System:

PLC

OEM/ODM:

Available

Total Power:

2600W

Power Supply:

AC220V

Air Pressure:

4-6bar

Mounting Accuracy:

±0.01mm

Type:

Automatic

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

±0.01mm mounting accuracy BGA Rework Station

CCD color optical alignment system BGA Rework Machine

±1℃ temperature accuracy Mobile Phone BGA Rework Station

Product Description

5 Modes Stepping Motor CCD Color Align System for Mobile Phone BGA Reworking Machine

Product Overview

Advanced BGA rework station featuring touch screen interface with precise temperature control and optical alignment system for mobile phone motherboard repair.

Key Features

5 work modes: Semi-auto/Manual/Remove/Mount/Weld
15" HD LCD monitor with 7" color touch screen interface
Stepping motor with CCD color optical alignment system
Temperature accuracy within ±1℃
Mounting precision within ±0.01mm
Repair success rate: 99%+
Independent research and development of single-chip control

Technical Specifications

Model	HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W(Max), bottom heater 1200W(Max)
Temperature Control	High precision K-sensor + closed loop control ±1℃
Locating System	V shape PCB support + universal fixture + laser centering
PCB Size Range	Max 140mm×160mm / Min 5mm×5mm
BGA Size Range	Max 50mm×50mm / Min 1mm×1mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG

Product Images

Company Profile

With over 10 years of professional SMT industry experience, we maintain strict production, inspection, debugging and packaging processes. We provide comprehensive pre-sales, in-sales and after-sales services with professional QC personnel ensuring equipment quality. All equipment undergoes thorough testing and debugging before shipment.

Tags:

Bga Rework Station Motherboard Repair Machine

Game Player Motherboard Repair Machine

±0.01mm mounting accuracy BGA Rework Station

Industrial Touch Screen Independent 3 Heating Zones Manual BGA Rework Station With CE Certification

Get Best Price

Hot Air Head And Mounting Head Integration Design BGA Rework Station

Get Best Price

5 Work Modes Stepping Motor CCD Color Optical Alignment System Mobile Phone BGA Rework Station

Get Best Price

Automatic & Manual Operation System Laser Position MCGS Touch Screen Control BGA Rework Station

Get Best Price

3 Heating Zones Manual BGA Rework Station with Industrial Touch Screen & CE

Get Best Price

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

products details

Automatic BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and ±1℃ Temperature Control for Mobile Phone PCB Repair

Automatic BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and ±1℃ Temperature Control for Mobile Phone PCB Repair

±0.01mm mounting accuracy BGA Rework Station

CCD color optical alignment system BGA Rework Machine

±1℃ temperature accuracy Mobile Phone BGA Rework Station