products details

Home Products

High Precision BGA Rework Station with ±0.01mm Mounting Accuracy and CCD Color Optical Alignment System for Mobile Phone Repair

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

PLC:

MITSUBISHI

Relay Brand:

Schneider

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Condition:

New

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Color:

Silver

Control System:

PLC

OEM/ODM:

Available

Total Power:

2600W

Power Supply:

AC220V

Air Pressure:

4-6bar

Mounting Accuracy:

±0.01mm

Type:

Automatic

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

±0.01mm Mounting Accuracy BGA Rework Station

CCD Color Optical Alignment System BGA Rework Station

±1℃ Temperature Accuracy BGA Rework Station

Product Description

High Precision Stepping Motor CCD Color Align System for Mobile Phone BGA Reworking

This advanced BGA rework station features high precision optical alignment technology for mobile phone motherboard repair, utilizing a stepping motor and CCD color optical system to achieve exceptional mounting accuracy.

Product Overview

BGA rework stations are categorized into optical alignment and non-optical alignment systems. Optical alignment employs a split prism imaging module for precise component placement, while non-optical alignment relies on visual alignment with PCB board silkscreen markings.

Technical Specifications

Model	HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W (Max), bottom heater 1200W (Max)
Electrical Components	Driving motor + smart temperature controller + color touch screen
Temperature Control	High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor	1 piece
Positioning Method	V-shape PCB support + external universal fixture + laser centering and positioning
Overall Dimensions	L450mm × W470mm × H670mm
PCB Size Range	Max 140mm × 160mm, Min 5mm × 5mm
BGA Size Range	Max 50mm × 50mm, Min 1mm × 1mm
PCB Thickness	0.3 - 5mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG
Maximum Chip Weight	150g
Working Modes	Five: Semi-auto/Manual/Remove/Mount/Weld
Application	Chips / phone motherboard repair

Key Features

5 versatile work modes for flexible operation
15" HD LCD monitor for clear visual feedback
7" HD color touch screen for intuitive control
Precision stepping motor for accurate positioning
CCD color optical alignment system for superior accuracy
Temperature accuracy within ±1℃
Mounting precision within ±0.01mm
Repair success rate: 99%+
Independent research and development of single-chip control

The BGA Rework Workstation is specialized welding equipment designed for repairing BGA packages. Available in automatic and manual configurations, this intelligent equipment handles various BGA component sizes, significantly improving repair productivity and success rates while reducing operational costs.

Product Images

Manufacturer Information

Shenzhen Hansome Technology Co., Ltd (HSTECH) is a professional manufacturer of SMT board handling equipment including loaders, unloaders, buffers, and conveyors. As a high-tech enterprise with independent intellectual property rights, the company specializes in research, development, production, and sales of SMT/THT production line board handling equipment. Our experienced engineering team continuously updates products and technology according to market demands, pursuing automation and cost-effective solutions while offering OEM services to meet specific customer requirements.

Tags:

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

products details

High Precision BGA Rework Station with ±0.01mm Mounting Accuracy and CCD Color Optical Alignment System for Mobile Phone Repair

High Precision BGA Rework Station with ±0.01mm Mounting Accuracy and CCD Color Optical Alignment System for Mobile Phone Repair

±0.01mm Mounting Accuracy BGA Rework Station

CCD Color Optical Alignment System BGA Rework Station

±1℃ Temperature Accuracy BGA Rework Station