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BGA Rework Station
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High Definition Touch Screen BGA Rework Station with ±0.01mm Mounting Accuracy and 2600W Total Power for Mobile Phone Repair

High Definition Touch Screen BGA Rework Station with ±0.01mm Mounting Accuracy and 2600W Total Power for Mobile Phone Repair

Brand Name: HSTECH
Model Number: HS-700
MOQ: 1 set
Price: Negotiable
Payment Terms: T/T,Western Union
Supply Ability: 100 sets per month
Detail Information
Place of Origin:
China
Certification:
CE
Product Name:
Mobile Phone BGA Rework Station
Warranty:
1 Year
Control:
Touch Screen
PLC:
MITSUBISHI
Relay Brand:
Schneider
Optoelectronic Switch:
OMRON
Material:
Aluminum Alloy
Condition:
New
Thickness:
0.3 - 5mm
Signal:
SMEMA
Application:
Electronic Assembly
Color:
Silver
Control System:
PLC
OEM/ODM:
Available
Total Power:
2600W
Power Supply:
AC220V
Air Pressure:
4-6bar
Mounting Accuracy:
±0.01mm
Type:
Automatic
Weight:
30KG
Packaging Details:
Wooden package
Supply Ability:
100 sets per month
Highlight:

High Definition Touch Screen BGA Rework Station

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±0.01mm Mounting Accuracy BGA Rework Station

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2600W Total Power BGA Chip Repair Machine

Product Description
High Definition Industrial Touch Screen BGA Rework Station HS-700
Product Overview

High-precision CCD color alignment system for PCB handling equipment designed for professional BGA chip rework applications.

Introduction to BGA Technology

BGA (Ball Grid Array) is a chip packaging technology where an array of solder balls on the substrate bottom serves as I/O connections to the printed circuit board. This packaging method enables digital devices to achieve smaller sizes, enhanced features, lower costs, and greater functionality. The BGA rework station is specialized equipment for repairing and replacing BGA chips.

Technical Specifications
Specification Details
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W(Max), bottom heater 1200W(Max)
Electrical Components Driving motor + smart temperature controller + color touch screen
Temperature Control High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor 1 piece
Positioning Method V-shape PCB support + external universal fixture + laser centering and positioning
Overall Dimensions L450mm × W470mm × H670mm
PCB Size Range Max 140mm×160mm, Min 5mm×5mm
BGA Size Range Max 50mm×50mm, Min 1mm×1mm
PCB Thickness 0.3 - 5mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
Maximum Chip Weight 150g
Working Modes Five: Semi-auto/Manual/Remove/Mount/Weld
Applications Chips / phone motherboard etc.
Key Features
  • 5 versatile work modes for flexible operation
  • 15" HD LCD monitor for clear visual feedback
  • 7" HD color touch screen for intuitive control
  • Precision stepping motor for accurate positioning
  • CCD color optical alignment system for perfect alignment
  • Temperature accuracy within ±1℃ for precise thermal control
  • Mounting precision within ±0.01mm for high-accuracy placement
  • Repair success rate: 99%+ for reliable performance
  • Independent research and development of single-chip control
Product Images
Manufacturer Information

Shenzhen Hansome Technology Co., Ltd (HSTECH) is a professional SMT board handling equipment manufacturer specializing in loaders, unloaders, buffers, conveyors, and related equipment. As a high-tech enterprise with independent intellectual property rights, the company focuses on research, development, production, and sales of SMT/THT production line board handling equipment.

Our experienced engineering team continuously updates products and technology according to market demands, pursuing automation and cost-effective solutions. We also provide OEM services based on customer requirements.