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Smart Temperature Control BGA Rework Station with Touch Screen and ±0.01mm Mounting Accuracy for Mobile Phone PCB Handling

Name: Smart Temperature Control BGA Rework Station with Touch Screen and ±0.01mm Mounting Accuracy for Mobile Phone PCB Handling
Brand: Shenzhen Hansome Technology Co., Ltd.
SKU: HS-700
Price: 6,005.00 USD
Availability: InStock

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

PLC:

MITSUBISHI

Relay Brand:

Schneider

Optoelectronic Switch:

OMRON

Material:

Aluminum Alloy

Condition:

New

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Color:

Silver

Control System:

PLC

OEM/ODM:

Available

Total Power:

2600W

Power Supply:

AC220V

Air Pressure:

4-6bar

Mounting Accuracy:

±0.01mm

Type:

Automatic

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

Mobile Phone PCB Handling Equipment

BGA Rework Station PCB Handling Equipment

Temperature Control PCB Handling Equipment

Product Description

Smart Temperature Control PCB Handling Equipment

Professional BGA rework station with advanced temperature control and CCD alignment system for mobile phone motherboard repair.

Model: HS-700

Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W (Max), bottom heater 1200W (Max)
Electrical Components	Driving motor + smart temperature controller + color touch screen
Temperature Control	High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor	1 piece
Positioning Method	V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions	L450mm × W470mm × H670mm
PCB Size Range	Max 140mm × 160mm, Min 5mm × 5mm
BGA Size Range	Max 50mm × 50mm, Min 1mm × 1mm
PCB Thickness	0.3 - 5mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG
Maximum Chip Weight	150g
Working Modes	Five modes: Semi-auto / Manual / Remove / Mount / Weld
Applications	Chips / phone motherboard repair

Key Features

Multilingual menu interface for global operation
Automatic feeding device for efficient workflow
X/Y axis joystick control for quick and convenient operation
Imported high-definition CCD (2 million pixels) optical alignment system
High precision temperature control sensing system with precise temperature regulation

Product Images

Tags:

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

products details

Smart Temperature Control BGA Rework Station with Touch Screen and ±0.01mm Mounting Accuracy for Mobile Phone PCB Handling

Smart Temperature Control BGA Rework Station with Touch Screen and ±0.01mm Mounting Accuracy for Mobile Phone PCB Handling

Mobile Phone PCB Handling Equipment

BGA Rework Station PCB Handling Equipment

Temperature Control PCB Handling Equipment