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BGA Rework Station
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Automatic BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and 2600W Total Power for PCB Handling

Automatic BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and 2600W Total Power for PCB Handling

Brand Name: HSTECH
Model Number: HS-700
MOQ: 1 set
Price: Negotiable
Payment Terms: T/T,Western Union
Supply Ability: 100 sets per month
Detail Information
Place of Origin:
China
Certification:
CE
Product Name:
Mobile Phone BGA Rework Station
Warranty:
1 Year
Control:
Touch Screen
PLC:
MITSUBISHI
Relay Brand:
Schneider
Optoelectronic Switch:
OMRON
Material:
Aluminum Alloy
Condition:
New
Thickness:
0.3 - 5mm
Signal:
SMEMA
Application:
Electronic Assembly
Color:
Silver
Control System:
PLC
OEM/ODM:
Available
Total Power:
2600W
Power Supply:
AC220V
Air Pressure:
4-6bar
Mounting Accuracy:
±0.01mm
Type:
Automatic
Weight:
30KG
Packaging Details:
Wooden package
Supply Ability:
100 sets per month
Highlight:

Stepping Motor PCB Handling Equipment

,

BGA Rework Station PCB Handling Equipment

Product Description
Stepping Motor CCD Color Align System PCB Handling Equipment
Professional BGA rework station with advanced CCD color optical alignment system for precision PCB handling and component repair.
Specifications
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W(Max), bottom heater 1200W(Max)
Electric Material Driving motor + smart temperature controller + color touch screen
Temperature Control High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor 1 piece
Locating Method V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions L450mm × W470mm × H670mm
PCB Size Max 140mm × 160mm, Min 5mm × 5mm
BGA Size Max 50mm × 50mm, Min 1mm × 1mm
Applicable PCB Thickness 0.3 - 5mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
Mount Chip Weight 150g
Working Modes Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Chips / phone motherboard etc.
Key Features
  • 5 work modes for versatile operation
  • 15" HD LCD monitor for clear visualization
  • 7" HD color touch screen for intuitive control
  • Precision stepping motor for accurate positioning
  • CCD color optical alignment system
  • Temperature accuracy within ±1℃
  • Mounting precision within ±0.01mm
  • Repair success rate: 99%+
  • Independent research and development of single-chip control
Technical Advantages
Optical Alignment System
High-definition CCD (2 million) digital imaging with automatic optical zoom system and manual control with laser red dot alignment for precise component placement.
Imported Heating Core
Utilizes imported heating core technology for fast heating, high precision temperature control, and extended service life.
Real-time Temperature Monitoring
Features real-time temperature display with automatic curve analysis function for optimal process control.
Fast Heating and Cooling
IR preheating zone with medium wave ceramic infrared heating, multi-functional movable PCB fixing bracket, BGA bottom support bracket, and laminar flow integrated cooling fan.
Packaging Details
Automatic BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and 2600W Total Power for PCB Handling 0 Automatic BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and 2600W Total Power for PCB Handling 1 Automatic BGA Rework Station with ±0.01mm Mounting Accuracy CCD Color Optical Alignment System and 2600W Total Power for PCB Handling 2