logo

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
BGA Rework Station
Created with Pixso.

Automatic BGA Rework Station with ±0.01mm Mounting Accuracy and Touch Screen Control for High-Precision Motherboard Repair

Automatic BGA Rework Station with ±0.01mm Mounting Accuracy and Touch Screen Control for High-Precision Motherboard Repair

Brand Name: HSTECH
Model Number: HS-700
MOQ: 1 set
Price: Negotiable
Payment Terms: T/T,Western Union
Supply Ability: 100 sets per month
Detail Information
Place of Origin:
China
Certification:
CE
Product Name:
Mobile Phone BGA Rework Station
Warranty:
1 Year
Control:
Touch Screen
PLC:
MITSUBISHI
Relay Brand:
Schneider
Optoelectronic Switch:
OMRON
Material:
Aluminum Alloy
Condition:
New
Thickness:
0.3 - 5mm
Signal:
SMEMA
Application:
Electronic Assembly
Color:
Silver
Control System:
PLC
OEM/ODM:
Available
Total Power:
2600W
Power Supply:
AC220V
Air Pressure:
4-6bar
Mounting Accuracy:
±0.01mm
Type:
Automatic
Weight:
30KG
Packaging Details:
Wooden package
Supply Ability:
100 sets per month
Highlight:

Bga Rework Station Motherboard Repair Machine

,

Game Player Motherboard Repair Machine

Product Description
HS-700 Mobile Laptop Game Player Motherboard Repair Machine BGA Rework Station
Professional BGA rework station designed for repairing mobile phones, laptops, game players, and various motherboard components with precision temperature control and advanced positioning systems.
Technical Specifications
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W (Max), bottom heater 1200W (Max)
Electrical Components Driving motor + smart temperature controller + color touch screen
Temperature Control High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor 1 piece
Positioning Method V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions L450mm × W470mm × H670mm
PCB Size Range Max 140mm×160mm, Min 5mm×5mm
BGA Size Range Max 50mm×50mm, Min 1mm×1mm
PCB Thickness 0.3 - 5mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
Maximum Chip Weight 150g
Working Modes Five: Semi-auto/Manual/Remove/Mount/Weld
Applications Chips / phone motherboard repair, etc.
Key Features
  • 5 versatile work modes for different repair scenarios
  • 15" HD LCD monitor for clear visual feedback
  • 7" HD color touch screen for intuitive operation
  • Precision stepping motor for accurate positioning
  • CCD color optical alignment system
  • Temperature accuracy within ±1℃
  • Mounting precision within ±0.01mm
  • Repair success rate: 99%+
  • Independent research and development of single-chip control
Performance Advantages
  • Superior Safety Protection: Dual protection mechanism with automatic alarm system for heating device failures, preventing product damage from sensor malfunctions
  • High Intelligence: Fully automated functions prevent operator errors and ensure efficiency in lead-free manufacturing and component rework processes
  • Exceptional Sensitivity: Prevents PCB main board damage from heating head during equipment operation
Product Images