products details

Home Products

Touch Screen BGA Rework Station with 3 Heating Zones and CE Certification for Electronic Assembly

Brand Name:	HSTECH
Model Number:	HS-520
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

Thickness:

0.3 - 5mm

Signal:

SMEMA

Application:

Electronic Assembly

Control System:

PLC

Power Supply:

AC220V

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

3 Heating Zones BGA Rework Station

Touch Screen Control BGA Chip Repair Machine

CE Certification PCB Handling Equipment

Product Description

Touch Screen BGA Rework Station with 3 Heating Zones

Professional manual BGA rework station designed for electronic assembly and repair, featuring industrial touch screen controls and three independent heating zones for precision component rework.

Product Overview

BGA rework stations are specialized equipment used to remove and replace BGA (Ball Grid Array) components on printed circuit boards. These surface-mount integrated circuits with solder ball grids require precise handling during repair and rework processes.

Key Features

Exceptional repair success rate exceeding 99%
Industrial-grade touch screen interface for easy operation
Three independent heating zones with hot air and infrared preheat
Precise temperature control with ±2℃ accuracy
CE certified for safety and quality compliance

Technical Specifications

Model	HS-520
Power Supply	AC 220V±10% 50/60Hz
Total Power	3800W
Overall Dimensions	460mm × 480mm × 500mm
PCB Size Range	Max: 300mm × 280mm, Min: 10mm × 10mm
BGA Size Range	Max: 60mm × 60mm, Min: 1mm × 1mm
PCB Thickness	0.3-5mm
Machine Weight	20kg
Warranty	3 years (first year free)
Applications	Chips, phone motherboards, and electronic components

Rework Process

The BGA rework process involves securing the PCB, precision heating to melt solder balls, careful component removal, pad cleaning, and precise placement of new components with controlled reflow heating.

Shipping & Delivery

Package	1 set per wooden carton
Dimensions	460mm × 480mm × 500mm
Weight	Approximately 20kg
Delivery Time	15-20 working days
Shipping Methods	Courier (4-7 days), Air (7 days), Sea (20-25 days)

Payment & Port

Accepted payment methods: D/P, T/T, Western Union, MoneyGram. Shipping port: Shenzhen.

Tags:

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

PCB Handling Equipment

Board Handling Equipment

PCB Depaneling Router Machine

Automatic Soldering Robot

PCB Loader

Screw Fastening Machine

Glue Dispensing Machine

PCB Depaneling Equipment

SMT Cleaning Equipment

PCB Unloader

SMT Nozzle

SMD Component Counter

SMT Machine Parts

Solder Paste Machine

Thermal Profiler

SMT Feeder

Dispensing Valve

BGA Rework Station

products details

Touch Screen BGA Rework Station with 3 Heating Zones and CE Certification for Electronic Assembly

Touch Screen BGA Rework Station with 3 Heating Zones and CE Certification for Electronic Assembly

3 Heating Zones BGA Rework Station

Touch Screen Control BGA Chip Repair Machine

CE Certification PCB Handling Equipment