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High Speed Touch Screen BGA Rework Station with 5 Modes Stepping Motor and CCD Color Optical Alignment System for ±0.01mm Mounting Accuracy

Brand Name:	HSTECH
Model Number:	HS-700
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T,Western Union,
Supply Ability:	100 sets per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

Mobile Phone BGA Rework Station

Warranty:

1 Year

Control:

Touch Screen

Material:

Aluminum Alloy

Signal:

SMEMA

Total Power:

2600W

Power Supply:

AC220V

Weight:

30KG

Packaging Details:

Wooden package

Supply Ability:

100 sets per month

Highlight:

5 Modes Stepping Motor BGA Rework Station

CCD Color Optical Alignment System BGA Chip Repair Machine

±0.01mm Mounting Accuracy PCB Handling Equipment

Product Description

High Speed Touch Screen BGA Rework Station With 5 Modes Stepping Motor CCD Color

BGA Rework Station Overview

BGA rework stations are specialized equipment used to remove and replace BGA components on printed circuit boards (PCBs). BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls on the underside, which pose unique challenges during repair and rework.

Key Components

Precision Heating System: Uses infrared or hot air to selectively heat BGA components for safe removal and installation
Component Removal and Placement Tools: Vacuum nozzles and specialized tools for gentle lifting and positioning
Alignment and Vision Systems: Cameras and software ensure precise BGA component alignment during placement
Rework Platforms: Secure, temperature-controlled environment for the rework process

Rework Process

Preparation: Secure PCB on rework platform and prepare area around target BGA component
Heating: Gradual heating melts solder balls for component removal
Removal: Careful component lifting without damaging underlying pads or traces
Cleaning: PCB pad cleaning to remove residual solder or flux
New Component Placement: Precise alignment and placement with reflow heating

Applications

Electronics Repair and Rework: Replacing faulty BGA components in consumer electronics, industrial equipment, and aerospace/defense systems
Prototype Modifications: Quick and accurate BGA rework during product development
Production Support: BGA component rework during small-scale or batch production runs

Product Features

5 work modes for versatile operation
15" HD LCD monitor for clear visual feedback
7" HD color touch screen interface
Stepping motor for precise control
CCD color optical alignment system
Temperature accuracy within ±1℃
Mounting precision within ±0.01mm
Repair success rate: 99%+
Independent research and development of single-chip control

Technical Specifications

Specification	Details
Model	HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total Power	2600W
Heater Power	Top heater 1200W (Max), bottom heater 1200W (Max)
Electric Material	Driving motor + smart temperature controller + color touch screen
Temperature Control	High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor	1 piece
Locating Method	V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions	L450mm × W470mm × H670mm
PCB Size	Max 140mm × 160mm, Min 5mm × 5mm
BGA Size	Max 50mm × 50mm, Min 1mm × 1mm
Applicable PCB Thickness	0.3 - 5mm
Mounting Accuracy	±0.01mm
Machine Weight	30KG
Mount Chip Weight	150g
Working Modes	Five: Semi-auto/Manual/Remove/Mount/Weld
Usage	Repair chips / phone motherboard etc

Packaging & Delivery

Item	Details
Package	1 set into one wooden carton for safety
External Dimension	450 × 470 × 670mm
Weight	Approximately 30kg
Delivery Time	Approximately 15-20 working days
Payment Methods	D/P, T/T, Western Union, MoneyGram
Port	Shenzhen
Shipment Options	A. By Courier: 4-7 Working days by special offer B. By Air: 7 Working days at appointed airport C. By Sea: 20-25 Working days at appointed port