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Brand Name: | HSTECH |
Model Number: | HS-300 |
MOQ: | 1 set |
Price: | Negotiable |
Payment Terms: | D/P, T/T, Western Union, MoneyGram |
Supply Ability: | 200 sets per month |
High Precision PCB Depaneling Equipment with Mobile Blade Mechanism
Introduce
The Blade Moving PCB Separators is a specialized tool designed for precisely cutting and efficiently separating printed circuit boards (PCBs). It employs a unique mechanism featuring a mobile blade division, enabling precise and controlled separation of PCBs.
working principle:
The Blade Moving PCB Separators utilizes one or multiple mobile blades to meticulously cut through the PCB surface, precisely following the predetermined segmentation lines. These blades possess the capability to traverse horizontally or vertically, ensuring accurate adherence to the designated cutting paths on the PCB board. The cutting operation relies on robust mechanical drives, including pneumatic or electric push rods, that supply ample power to execute the separation process with efficiency and precision.
High-precision separation
Using blade movement technology, precise cutting along the V-Cut line ensures the integrity of the circuit board.
High efficiency
Quickly process multiple PCBs, suitable for batch production, helping to improve production efficiency.
Easy to operate
Humanized design and friendly operation interface are convenient for users of various technical levels.
Adjustability
The cutting depth and pressure are adjustable to adapt to PCBs of different thicknesses and materials.
Safety
Equipped with safety protection devices to ensure the safety of operators.
Main component:
Mobile blade mechanism: Including blades, driving motors/cylinders, etc.
Positioning/guide system: Use optical sensors to achieve PCB positioning and guidance.
Entry and exit institutions: Automated equipment such as conveyor belts, robots.
Program control system: PLC or embedded controller to achieve fully automated operations.
Safety protection device: such as grating sensor, emergency stop switch, etc.
Features
This versatile machine is capable of cutting a wide range of boards featuring v-slots, demonstrating its adaptability and efficiency across various applications.
The blades are designed for durability, with the capability to be reshaped at least twice, extending their lifespan and reducing replacement costs.
The circular blade's height is adjustable, accommodating PCBs with varying heights of components, ensuring precise and seamless cutting for diverse board types.
The blade's movement is powered by a single motor, requiring minimal force stress and facilitating a smooth, effortless operation that is both easy and convenient to control.
Equipped with an induction function, the machine instantly halts operations upon detecting the operator's proximity to the blade's moving area, enhancing operator safety.
Prioritizing security, the machine boasts a double protective device, eliminating concerns over production safety and fostering a secure work environment.
Constructed with high-quality materials, the durable blades ensure longevity and reliability, minimizing downtime and maximizing productivity.
Specification
Model | HS-300 | |||
Voltage | 110V/220V(optional) | |||
Power | 100W | |||
Efficient cutting length | 5-360mm | |||
Blade size | Circular blade φ125*3mm, Linear blade 360*45*6mm | |||
Blade material | Import high quality high speed steel tool | |||
Separating speed | 300mm/s | |||
V-cut thickness | 1/3 of the board | |||
Separating width | Best 1-200mm | |||
Machine size | 620*320*450mm | |||
Weight | 50kg |
Application fields:
Electronic manufacturing industry:
Used to split printed circuit boards (PCBs).
Can accurately split PCBs of various sizes and types.
Widely used in consumer electronics, industrial electronics and other fields.
Solar cell manufacturing:
Used to split solar panels.
Can accurately cut silicon-based solar cells.
Improved the production efficiency of solar products.
Glass processing field:
Used to cut various glass products, such as mobile phone screens, glass panels, etc.
Can achieve precise splitting and reduce losses.
Ceramic industry:
Used to split ceramic chips, ceramic substrates and other workpieces.
Meet the requirements of high precision and high production efficiency.
Other industries:
Can be used to split materials such as plastics and metals.
Widely used in automated production in various manufacturing industries.