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Brand Name: | HSTECH |
Model Number: | HS-300 |
MOQ: | 1 set |
Price: | Negotiable |
Payment Terms: | D/P, T/T, Western Union, MoneyGram |
Supply Ability: | 200 sets per month |
High Precision PCB Depaneling Equipment with Mobile Blade Mechanism
Introduce
The Blade Moving PCB Separators represent a specialized instrument meticulously crafted for accurate cutting and efficient detachment of printed circuit boards (PCBs). By incorporating a distinctive mechanism that revolves around a mobile blade division, this tool facilitates precise and well-regulated separation of PCBs.
working principle:
The Blade Moving PCB Separators utilizes one or multiple mobile blades to meticulously cut through the PCB surface, precisely following the predetermined segmentation lines. These blades possess the capability to traverse horizontally or vertically, ensuring accurate adherence to the designated cutting paths on the PCB board. The cutting operation relies on robust mechanical drives, including pneumatic or electric push rods, that supply ample power to execute the separation process with efficiency and precision.
High-precision separation
Using blade movement technology, precise cutting along the V-Cut line ensures the integrity of the circuit board.
High efficiency
Quickly process multiple PCBs, suitable for batch production, helping to improve production efficiency.
Easy to operate
Humanized design and friendly operation interface are convenient for users of various technical levels.
Adjustability
The cutting depth and pressure are adjustable to adapt to PCBs of different thicknesses and materials.
Safety
Equipped with safety protection devices to ensure the safety of operators.
Main component:
Mobile blade mechanism: Including blades, driving motors/cylinders, etc.
Positioning/guide system: Use optical sensors to achieve PCB positioning and guidance.
Entry and exit institutions: Automated equipment such as conveyor belts, robots.
Program control system: PLC or embedded controller to achieve fully automated operations.
Safety protection device: such as grating sensor, emergency stop switch, etc.
Features
This flexible machinery excels in cutting an extensive array of v-slot-featured boards, showcasing its adaptability and efficiency across diverse applications.
Engineered for resilience, the blades can undergo reshaping at least twice, augmenting their longevity and mitigating replacement expenses.
The adjustable height of the circular blade accommodates PCBs with varying component elevations, guaranteeing precise and seamless cutting across a range of board types.
The blade's motion is driven by a solitary motor, minimizing force requirements and facilitating a smooth, effortless operation that is straightforward and convenient to manage.
Incorporating an induction function, the machine instantly halts operations upon sensing the operator's closeness to the blade's moving area, reinforcing operator safety.
With safety as a top priority, the machine boasts a dual protective mechanism, allaying any concerns over production safety and fostering a secure workplace.
Crafted from premium materials, the durable blades ensure long-lasting performance and reliability, minimizing downtime and maximizing overall productivity.
Specification
Model | HS-300 | |||
Voltage | 110V/220V(optional) | |||
Power | 100W | |||
Efficient cutting length | 5-360mm | |||
Blade size | Circular blade φ125*3mm, Linear blade 360*45*6mm | |||
Blade material | Import high quality high speed steel tool | |||
Separating speed | 300mm/s | |||
V-cut thickness | 1/3 of the board | |||
Separating width | Best 1-200mm | |||
Machine size | 620*320*450mm | |||
Weight | 50kg |
Application fields:
Electronic manufacturing industry:
Used to split printed circuit boards (PCBs).
Can accurately split PCBs of various sizes and types.
Widely used in consumer electronics, industrial electronics and other fields.
Solar cell manufacturing:
Used to split solar panels.
Can accurately cut silicon-based solar cells.
Improved the production efficiency of solar products.
Glass processing field:
Used to cut various glass products, such as mobile phone screens, glass panels, etc.
Can achieve precise splitting and reduce losses.
Ceramic industry:
Used to split ceramic chips, ceramic substrates and other workpieces.
Meet the requirements of high precision and high production efficiency.
Other industries:
Can be used to split materials such as plastics and metals.
Widely used in automated production in various manufacturing industries.