High-Speed Automatic Solder Paste Machine for Industrial 4.0 MES System

Automatic Solder Paste Printer for Industrial 4.0 MES System

Specification

Features

1. The CCD digital system boasts an innovative optical path design that provides uniform circular lighting and high-brightness coaxial illumination. The adjustable brightness of both light source systems, in an infinite loop, allows for seamless recognition of diverse mark points, including uneven ones on tin-plated, copper-plated, silver-plated surfaces, hot-air soldering points, FPCs, and PCBs of varying colors.

2. The system offers high-precision PCB thickness adjustment and a sturdy structure that guarantees stable XY movement. Manual adjustments make accommodating different PCB thicknesses straightforward.

3. The guide rail positioning system incorporates a detachable new pattern guide rail and a programmable flexible side clamp, tailored for FPCs and warped PCBs. A unique clamping plate device, controlled by software programming, automatically adapts to various PCB thicknesses without any issues.

4. The innovative squeegee structure design incorporates a comprehensive squeegee system that enhances stability and prolongs the squeegee's lifespan.

5. The high-speed stencil cleaning system features a downward dispensing cleaning structure that prevents clogged openings, a common issue that can lead to ineffective cleaning. The solvent dispense length can be effortlessly adjusted via software control.

6. The new multi-function interface is user-friendly, intuitive, and easy to understand. Additionally, it includes real-time monitoring of temperature and humidity.