Brand Name: | HSTECH |
Model Number: | HS-NK250 |
MOQ: | 1 set |
Price: | Negotiable |
Payment Terms: | T/T, Western Union, MoneyGram |
Supply Ability: | 100 sets per month |
SMT Production Line Good / No-good board Separating Magazine NG OK PCB Unloader
Intorduction
This unit is used after the AOI, by recieving the upstream AOI signal, automatic collect the NG/OK boards separately to relevant magazine.
Technical details
Function | Collect the NG/OK boards separately by receiving the signal. |
Transport height | 910±30mm |
Transportation direction | L~R, or R~L |
Board collect time | Each approx 6 seconds |
Magazine change over time | Approx 30seconds |
Track fixed side | Front side |
Operation side | Front side |
Conveyor belt | ESD |
PCB thickness | Min 0.6mm |
Pitch selection | 1-4(10mm pitch) |
Power supply | 220V,50/60Hz,±10% |
Power | 0.05kW |
Air pressure | 4-6Bar |
Air consumption | Max 15L/min |
Number of magazines | Upper:1 magazine, Bottom side:2 magazines |
Signal | SMEMA |
Options |
1, Touch screen control mode. 2, Automatic width adjustment. 3, Magazines quantity up to customer requirement.
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Features
1, PLC programing control.
2, Using friendly ‘soft touch’ LED membrane control panel
3, Selectable pitch setting.
4, Toggle level clamps provided for magazine alignment.
5, Pneumatic pusher’s pressure regulated.
6, High throughput with short magazine change-over time.
7, Collect NG/OK board from AOI, automatic store the NG/OK boards.
8, Standard SMEMA communication interface.
Model
Model | HS-NK250 | HS-NK330 | HS-NK390 | HS-NK460 |
Efficient PCB length | 50*50~350*250mm | 50*50~455*330mm | 50*50~530*390mm | 50*50~530*460mm |
PCB thickness | Min 0.6mm | Min 0.6mm | Min 0.6mm | Min 0.6mm |
Magazine size | 355*320*563mm | 460*400*563 | 535*460*570mm | 535*530*570mm |
Machine dimension | 1950*1600*1200mm | 2300*1760*1200mm | 2500*1880*1200mm | 2500*2160*1200mm |
Weight | 220kg | 280kg | 340kg | 380kg |
SMT production line equipment
1. Universal SMT machine: Using the program edited by the device to mount components onto designated parts positions, it can mount SOP 28 pin or more (including components that can be mounted by high-speed machines) roll, disc, or tubular packaging components. Its characteristics are high precision and diversity, but its installation speed is inferior to high-speed machines.
2. Reflow soldering: Use SMT solder paste or red glue to set an appropriate temperature curve to complete the soldering action between the solder paste and the part.
3. Unloader: The board is loaded into the magazine through a transfer track.