TCK Series Thermal Profiler Touch Screen USB RF For Electronic Assembly Reflow Temperature Testing

The TCK Series Thermal Profiler is an advanced temperature profiling system engineered to validate and optimize soldering processes in electronics manufacturing. Designed for both reflow oven profiling and wave solder profiling, this multi-channel data logger captures real-time thermal curves with laboratory-grade accuracy. Whether you are running lead-free SAC305 assemblies or specialized high-reliability boards, the TCK Series ensures your process stays within spec, complies with IPC/JEDEC standards, and eliminates costly rework. Compact, durable, and paired with intuitive analysis software, it is the essential tool for SMT engineers demanding repeatable quality and full traceability.

Standard Composition

1. Thermal profiler 2. Insulation box

3. Temperature test line 4. Data download line

5. Charger 6. Hi-temp adhesive tape

7. Software CD 8. “+” screwdriver 9. Tweezers

10. Insulated gloves 11. Solder wire

12. Scissors 13. Instrument box

14. User Manual 15. Acceptance Certificate

16. RF Transceiver (Choose Composition)

17. Wave Test System (Choose Composition)

Main Technical Specifications

1,Thermocouple: K-type thermocouple

2,Sampling interval:0.05sec---600sec Set with software

3,Record data:80000 point/channel, Can record 20 sets profile

4,Resolution: 0.1℃

5,Temperature measuring range: 0—1000℃

6,Temperature measuring accuracy: ±1.0℃

7,Total power: ≤120mW

8,Operating voltage:3.6VDC, rechargeable battery

9,Dimensions: 195(L)×82(W)×21(H)mm 195(L)×103(W)×21(H)mm

10, Insulation box:245(L)×100(W)×30(H)mm

10,Start Mode : Manual, specified time or specified temperature

11,Record mode: Monitor/Record

12,Connection mode:USB/RF

13,Software version:Profilermanager 2.0

• SMT Reflow Process Validation: Establish and verify optimal soak, peak, and TAL (Time Above Liquidus) parameters for new product introductions (NPI).
• Wave & Selective Soldering: Monitor preheat gradients and solder pot temperatures to prevent cold joints or PCB delamination.
• Curing & Bonding Processes: Profile UV/thermal cure ovens for underfill, conformal coating, and adhesive bonding applications.
• Automotive & Aerospace Electronics: Generate auditable thermal records required by IATF 16949, AS9100, and other quality management systems.
• Contract Manufacturing (EMS): Rapid changeover verification between customer jobs to ensure first-pass yield consistency.
• Failure Analysis & R&D: Diagnose tombstoning, voiding, or wetting issues by correlating thermal data with defect maps.

1. True Global Compatibility: Universal voltage charging, metric/imperial toggle, and multi-language software eliminate regional barriers—deploy anywhere without reconfiguration.
2. Lower Cost of Ownership: Replaceable heat shields and field-serviceable thermocouple connectors reduce long-term expenses versus sealed-unit competitors.
3. Software That Speaks Your Language: Intuitive UI requires minimal training; built-in PWI removes guesswork so operators—not just engineers—can validate profiles confidently.
4. Supply Chain Resilience: Standardized components and global calibration partnerships ensure fast turnaround, avoiding extended downtime waiting for factory repairs.
5. Scalable Product Family: Start with TCK-6 for basic lines and upgrade to TCK-12 for complex automotive boards—all using the same software platform and accessories.

Stop guessing and start profiling. Request a free demo unit evaluation or download our sample thermal profile report to see the TCK Series in action. Our application engineers are ready to help you select the right channel configuration and heat shield for your specific oven and board complexity.