TCK Series Touch Screen USB RF Thermal Profiler for SMT PCB Reflow Oven Test

TCK Series Touch Screen USB RF Wireless Thermal Profiler SMT Reflow Oven Temperature Profiler for Electronic Assembly PCB Profile Test Wave Soldering Temperature Recorder

Product Introduction

In modern electronics manufacturing and industrial curing processes, maintaining precise thermal profiles is critical to ensuring product reliability and solder joint integrity. The TCK Series Thermal Profiler is an advanced, high-precision temperature testing solution designed for both reflow and wave soldering processes. Capable of continuously testing up to 20 sets of temperature curves, this profiler combines robust hardware with intelligent analysis software to deliver accurate process window evaluation and curve optimization. Engineered for demanding factory environments, the TCK Series is your ultimate tool for achieving flawless thermal management.

Standard Composition

1.  Thermal profiler
2.  Insulation box
3.  Temperature test line
4.  Data download line
5.  Charger
6.  Hi-temp adhesive tape
7.  Software CD
8.  “+” screwdriver
9.  Tweezers
10.   Insulated gloves
11.   Solder wire
12.   Scissors
13.   Instrument box
14.   User Manual
15.   Acceptance Certificate
16.   RF Transceiver (Choose Composition)
17.   Wave Test System (Choose Composition)

Main Technical Specifications

1.  Thermocouple: K-type thermocouple
2.  Sampling interval:0.05sec---600sec Set with software
3.  Record data:80000 point/channel, Can record 20 sets profile
4.  Resolution: 0.1℃
5.  Temperature measuring range: 0—1000℃
6.  Temperature measuring accuracy: ±1.0℃
7.  Total power: ≤120mW
8.  Operating voltage:3.6VDC, rechargeable battery
9.  Dimensions: 195(L)×82(W)×21(H)mm 195(L)×103(W)×21(H)mm
10.   Insulation box:245(L)×100(W)×30(H)mm
11.   Start Mode : Manual, specified time or specified temperature
12.   Record mode: Monitor/Record
13.   Connection mode:USB/RF
14.   Software version:Profilermanager 2.0

Product Library Manager

Machine Library Manager

Solder Library Manager

Recipe Library Manager

Data analysis

PWI

Peak Temp,Times of overtop the Temp

Times of between Temp(Reflow)

Slope of between Temp(Reflow)

Slope of between Times(Wave)

Versatile Application Scenarios

• SMT/DIP Electronics Assembly: Essential for optimizing reflow oven and wave soldering temperature curves to prevent defects like cold solder joints or component thermal shock.
• Automotive & Appliance Coating: Precision temperature tracking for powder coating, non-stick paint, and automotive paint curing processes.
• Solar & Glass Manufacturing: Monitoring thermal profiles for solar panel lamination, glass tempering, and annealing processes.
• Industrial Curing & Heat Treatment: Accurate profiling for epoxy resin curing, UV paint baking, enamel sintering, and aluminum alloy heat treatment.

Why Choose Our TCK Series Thermal Profiler?

Ready to Perfect Your Thermal Process?